Patents by Inventor Bradley D. Sucher

Bradley D. Sucher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8053324
    Abstract: In one aspect provides a method of manufacturing a semiconductor device having improved transistor performance. In one aspect, this improvement is achieved by conducting a pre-deposition spacer deposition process wherein a temperature of a bottom region of a furnace is higher than a temperature of in the top region and is maintained for a predetermined period. The pre-deposition temperature is changed to a deposition temperature, wherein a temperature of the bottom region is lower than a temperature of the top region.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: November 8, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Bradley D. Sucher, Christopher S. Whitesell, Joshua J. Hubregsen, James H. Beatty
  • Publication number: 20110129979
    Abstract: In one aspect provides a method of manufacturing a semiconductor device having improved transistor performance. In one aspect, this improvement is achieved by conducting a pre-deposition spacer deposition process wherein a temperature of a bottom region of a furnace is higher than a temperature of in the top region and is maintained for a predetermined period. The pre-deposition temperature is changed to a deposition temperature, wherein a temperature of the bottom region is lower than a temperature of the top region.
    Type: Application
    Filed: August 1, 2007
    Publication date: June 2, 2011
    Applicant: Texas Instruments Inc.
    Inventors: Bradley D. Sucher, Christopher S. Whitesell, Joshua J. Hubregsen, James H. Beatty
  • Publication number: 20100144065
    Abstract: The invention provides a method for recycling/reclaiming a monitor or test wafer and a method for testing an integrated circuit manufacturing process. After a monitor wafer has been used for testing one or more semiconductor wafer processing steps to determine adequacy for use with production wafers, deposited materials and other residues from the tested processing steps are removed, and the stripped wafer is subjected to a thermal anneal to repair defects in its surface and return it to a reusable condition.
    Type: Application
    Filed: November 18, 2009
    Publication date: June 10, 2010
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Gary C. Barrett, Bradley D. Sucher, Colin L. Carr
  • Publication number: 20040110013
    Abstract: Semiconductor wafers exhibiting increased mechanical strength and reduced susceptibility to fracture and methods of making the same are disclosed. The improved mechanical strength arises from a thin coating of a refractory material deposited on the backside of the wafer. Preferably, the coating is comprised of a ceramic. More preferably, the coating is comprised of silicon carbide. Also disclosed are methods for evaluating different coating materials.
    Type: Application
    Filed: November 7, 2003
    Publication date: June 10, 2004
    Inventors: Karl J. Yoder, Bradley D. Sucher