Abstract: Technologies are described for devices to monitor a machine. The devices may comprise a battery pack module including a battery pack housing and a sensor module including a sensor module housing and a circuit board. The circuit board may include a substrate, a vibration sensor, a temperature sensor, a motor flux sensor, an ultrasonic sensor, and a processor. The vibration sensor may produce a vibration signal relating to vibration of the machine. The temperature sensor may produce a temperature signal relating to a temperature detected. The motor flux sensor may produce a motor flux signal relating to an amount of motor flux emitted by the machine. The ultrasonic sensor may produce an ultrasonic signal relating to ultrasonic waves reflected back from the machine. The processor may be in communication with the vibration sensor, the temperature sensor, the motor flux sensor, and the ultrasonic sensor.

Abstract: Technologies are described for rigid mounting connectors to connect a monitoring device to a piece of equipment. The rigid mounting connectors may comprise abase and a column. The column may be tubular in shape and include a bolt opening configured to receive a threaded end of a bolt. The base may extend axially from and be attached to outside walls of the column. A length of the column may be perpendicular to the base and the column may be at a center of the base. The base may include cylinders positioned on a circle concentric to a center of the bolt opening. Each screw channel may be configured to receive a screw to fasten at least one printed circuit board assembly to a top side of the base. The base may include footings which may protrude out from a bottom side of each cylinder.

Abstract: A device to detect a rotational run speed of a piece of rotating machinery. The device includes a processor in communication with a magnetic flux sensor, a vibration sensor, and a memory which includes instructions. The processor is configured to receive magnetic flux data and apply a fast Fourier transform to the magnetic flux data to generate transformed magnetic flux data. The processor is configured to determine a prominent fundamental frequency in the transformed magnetic flux data. For an electrical machine, this prominent fundamental frequency corresponds to the synchronous speed or the speed of the stator magnetic field. The processor is configured to receive vibration data and apply a fast Fourier transform to the vibration data to generate transformed vibration data.

Abstract: A device and method to measure vibration of a piece of equipment. The device includes a vibration sensor, a graphic user interface, a processor, and a memory. The processor is in communication with the vibration sensor, the graphic user interface, and the memory. The processor is configured to receive an input that includes information about a method used to mount the device to the piece of equipment, determine a vibration transfer function from the memory based on the input, and apply the vibration transfer function to vibration data generated by the vibration sensor to generate calibrated vibration data.

Abstract: Technologies are described for rigid mounting connectors to connect a monitoring device to a piece of equipment. The rigid mounting connectors may comprise abase and a column. The column may be tubular in shape and include a bolt opening configured to receive a threaded end of a bolt. The base may extend axially from and be attached to outside walls of the column. A length of the column may be perpendicular to the base and the column may be at a center of the base. The base may include cylinders positioned on a circle concentric to a center of the bolt opening. Each screw channel may be configured to receive a screw to fasten at least one printed circuit board assembly to a top side of the base. The base may include footings which may protrude out from a bottom side of each cylinder.

Abstract: Technologies are described for devices to monitor a machine. The devices may comprise a battery pack module including a battery pack housing and a sensor module including a sensor module housing and a circuit board. The circuit board may include a substrate, a vibration sensor, a temperature sensor, a motor flux sensor, an ultrasonic sensor, and a processor. The vibration sensor may produce a vibration signal relating to vibration of the machine. The temperature sensor may produce a temperature signal relating to a temperature detected. The motor flux sensor may produce a motor flux signal relating to an amount of motor flux emitted by the machine. The ultrasonic sensor may produce an ultrasonic signal relating to ultrasonic waves reflected back from the machine. The processor may be in communication with the vibration sensor, the temperature sensor, the motor flux sensor, and the ultrasonic sensor.

Abstract: The present invention provides wireless sensor technology seamlessly integrated into a pump system having a pump, a motor and a drive, has diagnostic and prognostic intelligence that utilizes sensor data, allows real-time condition monitoring; enables easy access to data and analytics via smart devices (i.e., smart phones and tablets); allows for easy remote monitoring (i.e., web portal) of the pump system; allows self-learning artificial intelligence (AI) built-in that adapts to changing conditions; and allows for smart pump system remote control. In operation, the present invention monitors the health and performance of the pump system that allows the user to get real-time data and intelligence virtually anywhere and anytime, as well as real-time diagnostics and prognostics, and also allows for smart control of the pump system remotely via smart device, and reduces downtime of equipment.

Abstract: A sensing module apparatus is provided for monitoring a vibrating machine or structure, such as a pump, which include three mounting points on the apparatus for securely mounting the apparatus to the vibrating machine or structure. The three-point mount configuration provides the sensor module with a very rigid mount connection to virtually any surface condition, including flat, curved or irregular. All six degrees of freedom (X, Y, Z, theta-X, theta-Y and theta-Z) are properly constrained. The three-point mount also provides an air barrier or gap between the sensing module and the equipment surface, allowing the sensor to be mounted to higher surface temperature devices.

Abstract: The present invention provides wireless sensor technology seamlessly integrated into a pump system having a pump, a motor and a drive, has diagnostic and prognostic intelligence that utilizes sensor data, allows real-time condition monitoring; enables easy access to data and analytics via smart devices (i.e., smart phones and tablets); allows for easy remote monitoring (i.e., web portal) of the pump system; allows self-learning artificial intelligence (AI) built-in that adapts to changing conditions; and allows for smart pump system remote control. In operation, the present invention monitors the health and performance of the pump system that allows the user to get real-time data and intelligence virtually anywhere and anytime, as well as real-time diagnostics and prognostics, and also allows for smart control of the pump system remotely via smart device, and reduces downtime of equipment.

Abstract: The present invention provides wireless sensor technology seamlessly integrated into a pump system having a pump, a motor and a drive, has diagnostic and prognostic intelligence that utilizes sensor data, allows real-time condition monitoring; enables easy access to data and analytics via smart devices (i.e., smart phones and tablets); allows for easy remote monitoring (i.e., web portal) of the pump system; allows self-learning artificial intelligence (AI) built-in that adapts to changing conditions; and allows for smart pump system remote control. In operation, the present invention monitors the health and performance of the pump system that allows the user to get real-time data and intelligence virtually anywhere and anytime, as well as real-time diagnostics and prognostics, and also allows for smart control of the pump system remotely via smart device, and reduces downtime of equipment.

Abstract: A sensing module apparatus is provided for monitoring a vibrating machine or structure, such as a pump, which include three mounting points on the apparatus for securely mounting the apparatus to the vibrating machine or structure. The three-point mount configuration provides the sensor module with a very rigid mount connection to virtually any surface condition, including flat, curved or irregular. All six degrees of freedom (X, Y, Z, theta-X, theta-Y and theta-Z) are properly constrained. The three-point mount also provides an air barrier or gap between the sensing module and the equipment surface, allowing the sensor to be mounted to higher surface temperature devices.

Abstract: The present invention provides wireless sensor technology seamlessly integrated into a pump system having a pump, a motor and a drive, has diagnostic and prognostic intelligence that utilizes sensor data, allows real-time condition monitoring; enables easy access to data and analytics via smart devices (i.e., smart phones and tablets); allows for easy remote monitoring (i.e., web portal) of the pump system; allows self-learning artificial intelligence (AI) built-in that adapts to changing conditions; and allows for smart pump system remote control. In operation, the present invention monitors the health and performance of the pump system that allows the user to get real-time data and intelligence virtually anywhere and anytime, as well as real-time diagnostics and prognostics, and also allows for smart control of the pump system remotely via smart device, and reduces downtime of equipment.

Abstract: A sensing module apparatus is provided for monitoring a vibrating machine or structure, such as a pump, which include three mounting points on the apparatus for securely mounting the apparatus to the vibrating machine or structure. The three-point mount configuration provides the sensor module with a very rigid mount connection to virtually any surface condition, including flat, curved or irregular. All six degrees of freedom (X, Y, Z, theta-X, theta-Y and theta-Z) are properly constrained. The three-point mount also provides an air barrier or gap between the sensing module and the equipment surface, allowing the sensor to be mounted to higher surface temperature devices.

Abstract: A magnetic mounting device is provided for mounting a vibrational sensor or other device to a machine or structure, and particularly a vibrating machine or structure. The magnetic mounting device includes a mount surface and a mounting base with an encapsulated magnet and including a three mounting projections projecting therefrom, which provide an exact constraint mounting of the magnetic mounting device on the vibrating machine or structure. The three-point mounting arrangement allows the magnetic mounting device to be rigidly mounted to flat, curved and irregular surfaces without requiring a specific orientation of the magnetic mounting device on the surface.

Abstract: A sensing module apparatus is provided for monitoring a vibrating machine or structure, such as a pump, which include three mounting points on the apparatus for securely mounting the apparatus to the vibrating machine or structure. The three-point mount configuration provides the sensor module with a very rigid mount connection to virtually any surface condition, including flat, curved or irregular. All six degrees of freedom (X, Y, Z, theta-X, theta-Y and theta-Z) are properly constrained. The three-point mount also provides an air barrier or gap between the sensing module and the equipment surface, allowing the sensor to be mounted to higher surface temperature devices.

Abstract: The present invention provides for a printing apparatus that includes an automatic backprinting assembly. The automatic backprinting assembly comprises a movable ink jet printhead that is movable between at least a printing position to print on the backside of photographic media and a priming position where the printhead is pressurized to force a stream of ink through discharge jets of the printhead.