Patents by Inventor Bradley Frank Allen

Bradley Frank Allen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11223099
    Abstract: An interface assembly includes a constraint layer formed from a material that provides a coefficient of thermal expansion match between first and second circuit board substrates. The constraint layer includes a waveguide cavity that extends between first and second opposing outer surface the constraint layer. The first and second circuit board substrates are respectively coupled to the first and second outer surfaces of the constraint layer via single ground connections. Portions of the first and second circuit board substrates are aligned with the waveguide cavity and positive connections are made between components of the first and second circuit boards through the waveguide cavity.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: January 11, 2022
    Assignee: Lockhead Martin Corporation
    Inventor: Bradley Frank Allen