Abstract: In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.

Abstract: A method of fabricating an electronic device includes depositing a metal layer having external leads on a carrier. A photoresist material layer is patterned on the leads. A dielectric layer is formed over the metal layer such that surfaces of metal pillars from the metal layer are exposed. The photoresist material layer is removed from the leads, and the dielectric layer and the metal layer are removed from the carrier. A die is attached to the first surface of the dielectric layer. The die includes contacts on a surface of the die that contacts the dielectric layer such that the contacts are aligned with and connect to the exposed surfaces of the metal pillars. A mold compound is formed over the die, the dielectric layer, the metal traces, and the metal pillars of the metal layer, but not over the leads of the metal layer.

Abstract: In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.

Abstract: In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.