Abstract: An alignment apparatus and method that provides a pick and placement tool that picks matrix leaded modules from trays, places the modules into a self-aligning nest, picks the modules from the nest and places them on a printed circuit board. The specific location and orientation of the nest with respect to a printed circuit board is known by the pick and placement tool. Once the nest has aligned the module, the tool picks the module from the nest and places it in the appropriate location on the printed circuit board. The nest has sloped sides that angle toward that bottom and are slippery. These sides funnel the module toward the bottom of the nest and correct gross misalignment. At the bottom inside of the nest are locating features into which the leads of the module fit. Between the locating features are slip surfaces so that the module leads slide into the locating features, correcting fine misalignment.