Abstract: A system for changing pressure in one or more tires of a self-propelled agricultural machine according to a load differential determined using load sensors on opposing locations of the machine. A load differential may be caused by a disproportionate distribution of forces and/or weight on the machine. Load sensors proximal to the tires may allow determining corresponding loads on the tires and, in turn, the load differential. As a result, tires experiencing greater loads may be inflated, whereas tires experiencing lesser loads may be deflated. In addition, a Human Machine Interface (HMI) may be provided in the operator cab to allow an operator to have further control over tire inflation on the fly while operating the machine.

Abstract: A system for changing pressure in one or more tires of a self-propelled agricultural machine according to a load differential determined using load sensors on opposing locations of the machine. A load differential may be caused by a disproportionate distribution of forces and/or weight on the machine. Load sensors proximal to the tires may allow determining corresponding loads on the tires and, in turn, the load differential. As a result, tires experiencing greater loads may be inflated, whereas tires experiencing lesser loads may be deflated. In addition, a Human Machine Interface (HMI) may be provided in the operator cab to allow an operator to have further control over tire inflation on the fly while operating the machine.

Abstract: Embodiments of the invention provide methods for depositing a material onto a surface of a substrate by using one or more electroless, electrochemical plating, CVD and/or ALD processes. Embodiments of the invention provide a method for depositing a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP process on a single substrate processing platform. Other aspects provide a method for depositing a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides a method for forming a capping layer over substrate interconnects. Methods include the use of a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.

Abstract: Embodiments of the invention provide a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers. In one aspect, a ruthenium-containing catalytic layer is formed. Embodiments of the invention provide a hybrid deposition system configured to deposit a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP cell. Other aspects provide an electroless deposition system configured to deposit a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides an electroless deposition system configured to form a capping layer over substrate interconnects. The system includes a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.