Patents by Inventor Bradley J. Brennan

Bradley J. Brennan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLAR RECEIVER SYSTEMS AND METHODS OF USE
    Publication number: 20240426517
    Abstract: The inventive systems include solar receivers that are used to heat chemical reactors (110, 310). When solar radiation is plentiful. the systems utilize the solar radiation to heat chemical reactors (110, 310) and store excess heat from the solar radiation in a heat storage component (104, 702). When solar radiation is not plentiful. the systems heat the chemical reactors (110, 310) using heat stored in the heat storage component (104, 702). Also described are methods of using and methods of constructing such systems.
    Type: Application
    Filed: October 20, 2022
    Publication date: December 26, 2024
    Applicant: Dimensional Energy, Inc.
    Inventors: Bradley J. Brennan, Jason Salfi, Howard M. Branz, Joerg Petrasch
  • Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
    Patent number: 11884859
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: January 30, 2024
    Assignee: Versum Materials US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan
  • Tungsten Chemical Mechanical Planarization (CMP) With Low Dishing And Low Erosion Topography
    Publication number: 20210340445
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Application
    Filed: July 16, 2021
    Publication date: November 4, 2021
    Applicant: Versum Materials US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan
  • Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography
    Patent number: 11111435
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: September 7, 2021
    Assignee: VERSUM MATERIALS US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan
  • Tungsten Chemical Mechanical Planarization (CMP) With Low Dishing And Low Erosion Topography
    Publication number: 20200040256
    Abstract: This invention pertains to compositions, methods and systems that can be used in chemical mechanical planarization (CMP) of a tungsten containing semiconductor device. CMP slurries comprising bicyclic amidine additives provide low dishing and low erosion topography.
    Type: Application
    Filed: July 24, 2019
    Publication date: February 6, 2020
    Applicant: Versum Materials US, LLC
    Inventors: Matthias Stender, Agnes Derecskei, Bradley J. Brennan