Abstract: It has been discovered that control of the intra-layer stress in layers of high refractive index materials, such as zirconia and titania, permits low net stress multilayer thin film stacks comprising alternating layers of the high refractive index material and silica, a low refractive index material, to be sputter-deposited on glass substrates. In particular, a simple, cost-effective and readily reproducible post-deposition annealing process is used, i.e., an annealing process that can be effected within a broad temperature range and for a brief and substantially open-ended time period, to change the post-deposition microstructure of the high refractive index film layers and create a selected intra-layer tensile stress. The intra-layer tensile stress created during such an annealing process is largely dependent on the post-deposition microstructure of the high refractive index thin film layers.

Abstract: It has been discovered that control of the intra-layer stress in layers of high refractive index materials, such as zirconia and titania, permits low net stress multilayer thin film stacks comprising alternating layers of the high refractive index material and silica, a low refractive index material, to be sputter-deposited on glass substrates. In particular, a simple, cost-effective and readily reproducible post-deposition annealing process is used, i.e., an annealing process that can be effected within a broad temperature range and for a brief and substantially open-ended time period, to change the post-deposition microstructure of the high refractive index film layers and create a selected intra-layer tensile stress. The intra-layer tensile stress created during such an annealing process is largely dependent on the post-deposition microstructure of the high refractive index thin film layers.

Abstract: The present invention is directed to a sputtering method for preparing optical coatings having low light scattering characteristics by controlling the angle of incidence of the material being sputtered without significantly reducing the coating efficiency of the sputtering process. The angle of incidence is controlled by reducing the collision scattering of the material being sputtered and by intercepting the sputtered material that would without interception arrive at the surface to be coated at high angles of incidence. The collision scattering is reduced by utilizing a sputtering gas that has a mass less than the mass of the material being sputtered.