Abstract: The present invention provides methods, systems, assemblies, and articles for extracting restrained liquid (e.g., surface tension-restrained liquid) from open wells in a chip, where the restrained liquid does not flow out of the wells due to gravity when the wells are held upside down. For example, the present invention provides extraction fixtures that may be attached to, and/or held adjacent to, a chip such that any restrained liquid that is forced out of the open wells is collected by, or flows through, the extraction fixtures. Also for example, the present invention provides assemblies composed of a extraction fixture attached to, and/or held adjacent to, a chip, and methods of subjecting such assemblies to a force such that at least a portion of the restrained liquid in the open wells is forced out and collected by, or flows through, the extraction fixture.

Abstract: The present invention provides methods, systems, assemblies, and articles for capturing single cells with a polymer capture film. In certain embodiments, the polymer capture films comprise a plurality of individual channels with top and bottom openings, where the channels are dimensioned such that a single cell is: i) is captured inside the channel, partially or substantially occluding the channel, when negative pressure is provided to the bottom opening; or ii) is captured by the top opening, but does not enter the channel, when negative pressure is provided to the bottom opening. In some embodiments, the channels of the polymer capture film align with the wells of a multi-well chip such that the cell, or the contents of the single cell, may be transferred to a corresponding well.

Abstract: The present invention provides methods, systems, assemblies, and articles for capturing single cells with a capture chip. In certain embodiments, the capture chip comprises a substrate comprising a plurality of cell-sized dimples or wells that each allow a single cell to be captured from a cell suspension. In some embodiments, the dimples or wells of the capture chip align with the holes or wells of a multi-well through-hole chip, and/or a multi-well chip, such that the cell, or the contents of the single cell, may be transferred to a corresponding well of the multi-well chip. In particular embodiments, the bottom of each dimple or well of the capture chip has a positive electrical charge sufficient to attract cells from a cell suspension flowing over the dimples or wells.

Abstract: The present invention provides methods, systems, assemblies, and articles for capturing single cells with a capture chip. In certain embodiments, the capture chip comprises a substrate comprising a plurality of cell-sized dimples or wells that each allow a single cell to be captured from a cell suspension. In some embodiments, the dimples or wells of the capture chip align with the holes or wells of a multi-well through-hole chip, and/or a multi-well chip, such that the cell, or the contents of the single cell, may be transferred to a corresponding well of the multi-well chip. In particular embodiments, the bottom of each dimple or well of the capture chip has a positive electrical charge sufficient to attract cells from a cell suspension flowing over the dimples or wells.

Abstract: The present invention provides methods, systems, assemblies, and articles for extracting restrained liquid (e.g., surface tension-restrained liquid) from open wells in a chip, where the restrained liquid does not flow out of the wells due to gravity when the wells are held upside down. For example, the present invention provides extraction fixtures that may be attached to, and/or held adjacent to, a chip such that any restrained liquid that is forced out of the open wells is collected by, or flows through, the extraction fixtures. Also for example, the present invention provides assemblies composed of a extraction fixture attached to, and/or held adjacent to, a chip, and methods of subjecting such assemblies to a force such that at least a portion of the restrained liquid in the open wells is forced out and collected by, or flows through, the extraction fixture.

Abstract: The present invention provides methods, systems, assemblies, and articles for extracting restrained liquid (e.g., surface tension-restrained liquid) from open wells in a chip, where the restrained liquid does not flow out of the wells due to gravity when the wells are held upside down. For example, the present invention provides extraction fixtures that may be attached to, and/or held adjacent to, a chip such that any restrained liquid that is forced out of the open wells is collected by, or flows through, the extraction fixtures. Also for example, the present invention provides assemblies composed of a extraction fixture attached to, and/or held adjacent to, a chip, and methods of subjecting such assemblies to a force such that at least a portion of the restrained liquid in the open wells is forced out and collected by, or flows through, the extraction fixture.

Abstract: The present invention provides methods, systems, assemblies, and articles for capturing single cells with a capture chip. In certain embodiments, the capture chip comprises a substrate comprising a plurality of cell-sized dimples or wells that each allow a single cell to be captured from a cell suspension. In some embodiments, the dimples or wells of the capture chip align with the holes or wells of a multi-well through-hole chip, and/or a multi-well chip, such that the cell, or the contents of the single cell, may be transferred to a corresponding well of the multi-well chip. In particular embodiments, the bottom of each dimple or well of the capture chip has a positive electrical charge sufficient to attract cells from a cell suspension flowing over the dimples or wells.

Abstract: The present invention provides methods, systems, assemblies, and articles for capturing single cells with a polymer capture film. In certain embodiments, the polymer capture films comprise a plurality of individual channels with top and bottom openings, where the channels are dimensioned such that a single cell is: i) is captured inside the channel, partially or substantially occluding the channel, when negative pressure is provided to the bottom opening; or ii) is captured by the top opening, but does not enter the channel, when negative pressure is provided to the bottom opening. In some embodiments, the channels of the polymer capture film align with the wells of a multi-well chip such that the cell, or the contents of the single cell, may be transferred to a corresponding well.

Abstract: The present invention provides methods, systems, assemblies, and articles for capturing single cells with a polymer capture film. In certain embodiments, the polymer capture films comprise a plurality of individual channels with top and bottom openings, where the channels are dimensioned such that a single cell is: i) is captured inside the channel, partially or substantially occluding the channel, when negative pressure is provided to the bottom opening; or ii) is captured by the top opening, but does not enter the channel, when negative pressure is provided to the bottom opening. In some embodiments, the channels of the polymer capture film align with the wells of a multi-well chip such that the cell, or the contents of the single cell, may be transferred to a corresponding well.

Abstract: The present invention provides methods, systems, assemblies, and articles for extracting restrained liquid (e.g., surface tension-restrained liquid) from open wells in a chip, where the restrained liquid does not flow out of the wells due to gravity when the wells are held upside down. For example, the present invention provides extraction fixtures that may be attached to, and/or held adjacent to, a chip such that any restrained liquid that is forced out of the open wells is collected by, or flows through, the extraction fixtures. Also for example, the present invention provides assemblies composed of a extraction fixture attached to, and/or held adjacent to, a chip, and methods of subjecting such assemblies to a force such that at least a portion of the restrained liquid in the open wells is forced out and collected by, or flows through, the extraction fixture.

Abstract: A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured.

Abstract: A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured.

Abstract: A thin MCM packaging structure and technique is provided in which a thin film decal interconnect circuit is fabricated on a thin aluminum wafer. The thin-film decal interconnect employs Au metallurgy for bonding and comprises a bond pad/ground plane layer, topside pads, and one or more routing layers. The top routing layer also acts as the pad layer along the edge of the interconnect structure. The underside of the decal interconnect structure is provided with metal pads for attachment to conventional aluminum or gold I/O pads on one surface of the integrated circuit die. A thermosonic bonding system is used to bond the die pads to the pads. The aluminum wafer is selectively removed forming one or more cavities to hold one or more die to be mounted on the MCM structure. The die are oriented with their pads in contact with contact pads on the thin-film decal interconnect to which they are bonded and the cavities are filled with a liquid encapsulant and cured.

Abstract: An embodiment of the present invention is a system for rinsing and drying items comprising a process chamber for receiving the items; a rinse condenser; a first heater; a vaporizer for vaporizing water and including a second heater; a vacuum system for reducing the pressure within the process chamber; and a valving apparatus for independently coupling the process chamber to the vaporizer and the process chamber to the vacuum system.