Patents by Inventor Bradley Morgan Haskett
Bradley Morgan Haskett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240128199Abstract: An example ceramic panel has a first surface and a second surface. The ceramic panel has a bond finger well on the first surface of the ceramic panel a scribe line well on the second surface of the ceramic panel. The ceramic panel also has a scribe line along the scribe line well.Type: ApplicationFiled: December 22, 2023Publication date: April 18, 2024Inventors: Jane Qian Liu, Bradley Morgan Haskett
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Patent number: 11923258Abstract: An example includes: a substrate having a first package surface, having a second package surface opposite the first package surface, and having a die cavity with a depth extending into the first package surface; a semiconductor die having bond pads on a first die surface and having a second die surface opposite the first die surface, the semiconductor die having a die thickness, the second die surface of the semiconductor die mounted in the die cavity; a cover over a portion of the first die surface; conductors coupling the bond pads of the semiconductor die to bond fingers on the first package surface of the substrate; and dielectric material over the conductors, the bond fingers, the bond pads, at least a portion of the first semiconductor die and at least a portion of the cover, wherein the dielectric material extends above the first package surface of the substrate.Type: GrantFiled: September 8, 2021Date of Patent: March 5, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: William Robert Morrison, Bradley Morgan Haskett
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Patent number: 11894313Abstract: An example ceramic panel has a first surface and a second surface. The ceramic panel has a bond finger well on the first surface of the ceramic panel a scribe line well on the second surface of the ceramic panel. The ceramic panel also has a scribe line along the scribe line well.Type: GrantFiled: October 27, 2020Date of Patent: February 6, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Jane Qian Liu, Bradley Morgan Haskett
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Publication number: 20220189836Abstract: An example includes: a substrate having a first package surface, having a second package surface opposite the first package surface, and having a die cavity with a depth extending into the first package surface; a semiconductor die having bond pads on a first die surface and having a second die surface opposite the first die surface, the semiconductor die having a die thickness, the second die surface of the semiconductor die mounted in the die cavity; a cover over a portion of the first die surface; conductors coupling the bond pads of the semiconductor die to bond fingers on the first package surface of the substrate; and dielectric material over the conductors, the bond fingers, the bond pads, at least a portion of the first semiconductor die and at least a portion of the cover, wherein the dielectric material extends above the first package surface of the substrate.Type: ApplicationFiled: September 8, 2021Publication date: June 16, 2022Inventors: William Robert Morrison, Bradley Morgan Haskett
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Publication number: 20220130771Abstract: An example ceramic panel has a first surface and a second surface. The ceramic panel has a bond finger well on the first surface of the ceramic panel a scribe line well on the second surface of the ceramic panel. The ceramic panel also has a scribe line along the scribe line well.Type: ApplicationFiled: October 27, 2020Publication date: April 28, 2022Inventors: Jane Qian Liu, Bradley Morgan Haskett
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Patent number: 8445984Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: GrantFiled: May 3, 2011Date of Patent: May 21, 2013Assignees: Texas Instruments Incorporated, Amkor Technology, Inc.Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffrey Alan Miks, Mark Phillip Popovich
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Patent number: 8138588Abstract: A package frame for use in packaging microelectromechanical devices and/or spatial light modulators comprises a frame, a stiffener, and a heat dissipater.Type: GrantFiled: December 21, 2006Date of Patent: March 20, 2012Assignee: Texas Instruments IncorporatedInventor: Bradley Morgan Haskett
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Publication number: 20110204464Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: ApplicationFiled: May 3, 2011Publication date: August 25, 2011Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffery Alan Miks, Mark Phillip Popovich
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Patent number: 7936033Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: GrantFiled: December 29, 2008Date of Patent: May 3, 2011Assignees: Texas Instruments Incorporated, Amkor Technology, Inc.Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffery Alan Miks, Mark Phillip Popovich
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Patent number: 7894121Abstract: A light valve assembly comprises a holographic optical element and a light valve that comprises an array of individually addressable pixels. The light valve assemblies can be fabricated on the die level or on a wafer-level.Type: GrantFiled: November 15, 2007Date of Patent: February 22, 2011Assignee: Texas Instruments IncorporatedInventors: Vincent C. Lopes, Bradley Morgan Haskett, Steven Monroe Penn
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Patent number: 7786747Abstract: Microdisplay assemblies, methods of packaging microdisplays, and methods of testing microdisplays are disclosed. In accordance with one embodiment, a microdisplay assembly includes a support and a microdisplay disposed on the support. The microdisplay includes a semiconductor workpiece mounted to the support and an optical device region disposed over the semiconductor workpiece. A plurality of contacts is disposed over a portion of the semiconductor workpiece, wherein each of the plurality of contacts comprises a protruding feature.Type: GrantFiled: November 30, 2007Date of Patent: August 31, 2010Assignee: Texas Instruments IncorporatedInventors: Wei-Yan Shih, Bradley Morgan Haskett, Braden Peter D'Andrea
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Publication number: 20100164081Abstract: According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.Type: ApplicationFiled: December 29, 2008Publication date: July 1, 2010Applicant: Texas Instruments IncorporatedInventors: Bradley Morgan Haskett, John Patrick O'Connor, Mark Myron Miller, Sean Timothy Crowley, Jeffery Alan Miks, Mark Phillip Popovich
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Publication number: 20090140757Abstract: Microdisplay assemblies, methods of packaging microdisplays, and methods of testing microdisplays are disclosed. In accordance with one embodiment, a microdisplay assembly includes a support and a microdisplay disposed on the support. The microdisplay includes a semiconductor workpiece mounted to the support and an optical device region disposed over the semiconductor workpiece. A plurality of contacts is disposed over a portion of the semiconductor workpiece, wherein each of the plurality of contacts comprises a protruding feature.Type: ApplicationFiled: November 30, 2007Publication date: June 4, 2009Inventors: Wei-Yan Shih, Bradley Morgan Haskett, Braden Peter D'Andrea
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Publication number: 20090128873Abstract: A light valve assembly comprises a holographic optical element and a light valve that comprises an array of individually addressable pixels. The light valve assemblies can be fabricated on the die level or on a wafer-level.Type: ApplicationFiled: November 15, 2007Publication date: May 21, 2009Applicant: Texas Instruments IncorporatedInventors: Vincent C. Lopes, Bradley Morgan Haskett, Steven Monroe Penn
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Patent number: 7402458Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.Type: GrantFiled: April 28, 2005Date of Patent: July 22, 2008Assignee: Texas Instruments IncorporatedInventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Faris
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Publication number: 20080151353Abstract: A package frame for use in packaging microelectromechanical devices and/or spatial light modulators comprises a frame, a stiffener, and a heat dissipater.Type: ApplicationFiled: December 21, 2006Publication date: June 26, 2008Applicant: Texas Instruments Inc.Inventor: Bradley Morgan Haskett
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Patent number: 6894853Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.Type: GrantFiled: May 10, 2002Date of Patent: May 17, 2005Assignee: Texas Instruments IncorporatedInventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Farris
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Publication number: 20030210452Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.Type: ApplicationFiled: May 10, 2002Publication date: November 13, 2003Applicant: Texas Instruments, Inc.Inventors: Bradley Morgan Haskett, John Patrick O'Connor, Steven E. Smith, Mark Myron Miller, Ivan Kmecko, Jwei Wien Liu, Edward Carl Fisher, Frank O. Armstrong, Daniel C. Estabrook, Jeffrey E. Farris