Abstract: A valve is disclosed. The valve can be mounted through a wall, for example in the hull wall of a submersible vehicle. The internal components of the valve can be readily removed, serviced and/or replaced without removing the valve body from the wall. A filling assembly is also disclosed, which mates with the valve to deliver a fluid from one side of the wall, through the valve and into a storage tank or other apparatus disposed on the opposite side of the wall. The filling assembly actuates the valve to open a fluid pathway therethrough in order to deliver fluid to a storage tank or other apparatus connected to the valve's exit port.

Abstract: Apparatus and methods for applying atomized pulsed streams of flux to a surface such as a printed circuit board. The flux is applied discretely in selected locations and at selected thickness based upon pulse rate, fluid pressure, air pressure and traverse speed. The apparatus consists of a precise orifice with a surrounding air passage for atomizing and focusing the flux at a discrete location on the surface. Controls are incorporated for selecting, controlling and monitoring the flux deposition amount and location, for coordinating with the transport motion system, for integrating with the adjacent air flow and for selecting the atomized or non-atomized method of application.

Abstract: Apparatus and methods for applying atomized pulsed streams of flux to a surface such as a printed circuit board. The flux is applied discretely in selected locations and at selected thickness based upon pulse rate, fluid pressure, air pressure and traverse speed. The apparatus consists of a precise orifice with a surrounding air passage for atomizing and focusing the flux at a discrete location on the surface. Controls are incorporated for selecting, controlling and monitoring the flux deposition amount and location, for coordinating with the transport motion system, for integrating with the adjacent air flow and for selecting the atomized or non-atomized method of application.

Abstract: A dispensing apparatus for applying a pulsed thin stream of flux to a surface such as a printed circuit board. The stream of flux is pulsed at a high rate to apply a thin layer of flux on the surface. The dispensing head consists of multiple orifices for applying the flux to the board. The streams of flux are angularly disposed and a pan is positioned for capturing flux which passes by the board. The board is conveyed by the dispensing head. Controls are incorporated for board sensing and identification, application width selection, precise pressure control, fluid flow monitoring and system safety conditions.

Abstract: A dispensing apparatus for applying a thin stream of flux to a surface of a printed circuit board. The dispensing head travels at a high rate of speed relative to the board during the dispensing of flux to apply thin layers of flux thereto. Preferably, the dispensing head moves transversely to the work path of a conveyor that transports the board through a flux station, at a rate of approximately 20 to 90 inches per second. Tips that dispense the flux are angularly disposed relative to the board and, if desired, make multiple passes over the surface to coat selected regions twice. Either the board is incrementally advanced through the flux station or the dispensing head is incrementally advanced relative to the board so that flux is applied when the board is stationary.

Abstract: Apparatus and methods for spray coating selected areas of a circuit board with an insulative coating material without coating regions of the circuit board to be left uncoated. A liquid spray device emits the coating material and an air assist attachment connected to the liquid spray device directs jets of air into impinging relation with the coating material emitted therefrom to transform the coating material into an atomized, shaped spray pattern for coating the selected areas. The air assist attachment can be disabled so that the spray device transforms the coating material into a non-atomized, shaped spray pattern for coating selected areas without coating regions of the circuit board to be left uncoated.