Abstract: A 3-D printed device comprising one or more structures, the structures comprising a plurality of magnetically responsive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a magnetic ink composition; applying the magnetic ink composition to a substrate in a 3-D solvent cast printing process to form one or more structures; and drying the one or more structures formed from the magnetic ink composition. The dried structures can exhibit one or more regions of magnetic permeability greater than 1.3×10?6 H/m.

Abstract: In some embodiments, a method of forming a structure includes: forming a liquid oxide material at a low temperature by dissolving fumed nanoparticles in a liquid hydrate of a silicate or an aluminate; applying the liquid oxide material on a substrate; and at a low temperature, curing the liquid oxide material to evolve gaseous water, leaving structural silicate glass.

Abstract: A 3-D printed device comprising one or more interconnect structures, the interconnect structures comprising a plurality of conductive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a conductive ink composition; applying the conductive ink composition to a substrate in a 3-D solvent cast printing process to form one or more interconnect structures; and drying the one or more interconnect structures formed from the conductive ink composition. The dried interconnect structures exhibit a conductivity equal to or greater than 1×105 S/m without having to be subjected to any post-processing sintering treatment.

Abstract: A 3-D printed device comprising one or more structures, the structures comprising a plurality of magnetically responsive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a magnetic ink composition; applying the magnetic ink composition to a substrate in a 3-D solvent cast printing process to form one or more structures; and drying the one or more structures formed from the magnetic ink composition. The dried structures can exhibit one or more regions of magnetic permeability greater than 1.3×10?6 H/m.

Abstract: In some embodiments, a method of forming a structure includes: forming a liquid oxide material at a low temperature by dissolving fumed nanoparticles in a liquid hydrate of a silicate or an aluminate; applying the liquid oxide material on a substrate; and at a low temperature, curing the liquid oxide material to evolve gaseous water, leaving structural silicate glass.

Abstract: A 3-D printed device comprising one or more interconnect structures, the interconnect structures comprising a plurality of conductive particles and one or more diblock or triblock copolymers; the diblock or triblock copolymers having an A-B, A-B-A, or A-B-C block-type structure in which the A-blocks and C-blocks are an aromatic-based polymer or an acrylate-based polymer and the B-blocks are an aliphatic-based polymer. These 3-D printed devices may be formed using a method that comprises providing a conductive ink composition; applying the conductive ink composition to a substrate in a 3-D solvent cast printing process to form one or more interconnect structures; and drying the one or more interconnect structures formed from the conductive ink composition. The dried interconnect structures exhibit a conductivity equal to or greater than 1×105 S/m without having to be subjected to any post-processing sintering treatment.

Abstract: The present invention relates to microcapsules with a core-shell or matrix morphology stabilized by cross-linked nanoparticles. A process for the preparation of said microcapsules comprising selecting internal crosslinking of a Pickering emulsion is also an object of the invention. Perfumed consumer products, in particular fine fragrance, home and personal care products are also part of the invention.

Abstract: The present invention relates to microcapsules with a core-shell or matrix morphology stabilized by cross-linked nanoparticles. A process for the preparation of said microcapsules comprising selecting internal crosslinking of a Pickering emulsion is also an object of the invention. Perfumed consumer products, in particular fine fragrance, home and personal care products are also part of the invention.