Abstract: A heat transfer arrangement for use with an immersion cooling system. A support is configured to contact a heat transfer device such as a vapor chamber or spreader plate to stiffen the heat transfer device and urge the heat transfer device into contact with a heat generating device. The support includes an arm that has a first portion that extends toward a central area of the heat transfer device over and out of contact with the heat transfer device and a second portion that contacts the heat transfer device within the central area. The arm can avoid contact with the heat transfer device, including surfaces having a boiling enhancement coating configured to transfer heat to a cooling liquid.

Abstract: A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.

Abstract: A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

Abstract: A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.

Abstract: A heat transfer device such as a heat sink includes one or more fins for dissipating heat received from a heat source, such as an integrated circuit or other electronic component. A thermosiphon component including a tube that defines a closed, continuous loop and contains a working fluid is attached to a face of a corresponding fin and is arranged to operate as a two-phase thermosiphon to transfer heat across areas of the fin. The heat transfer may equalize temperatures across the fin, enhancing efficiency.

Abstract: Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.

Abstract: Method and assembly for attaching a heat sink to a heat source surface associated with a printed circuit board or other component having a heat source. A fastener assembly may include a push pin with a barbed, bifurcated end arranged to be inserted through an opening of the printed circuit board and thereby secure the heat sink to the printed circuit board. A stopper may be headless, be separable from the push pin, and have a portion, such as a barrel-shaped element, positionable in a throughbore of the push pin that supports the bifurcated end so that movement of the barbed portions toward each other is resisted, thereby securing engagement of the barbed portions with the printed circuit board.

Abstract: A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states.

Abstract: A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface.

Abstract: A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface.

Abstract: A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

Abstract: A heat exchanger includes a corrugated metal sheet comprising a first side having a plurality of first troughs alternating with a plurality of first peaks, and a second side having a plurality of second troughs alternating with a plurality of second peaks, each trough being formed by a pair of walls, each wall separating the first side from the second side and extending from a first peak to a second peak, the troughs and peaks extending in parallel and defining a longitudinal direction. Each first peak is formed with at least one depression, the depressions in respective peaks being aligned to form at least one tube-receiving channel extending transversely to the longitudinal direction. Each depression has a contact surface formed in the first side and extending laterally over each adjacent first trough. A tube section is received in each tube-receiving channel in substantially conforming contact with the contact surfaces.

Abstract: A heat exchanger includes a corrugated metal sheet comprising a first side having a plurality of first troughs alternating with a plurality of first peaks, and a second side having a plurality of second troughs alternating with a plurality of second peaks, each trough being formed by a pair of walls, each wall separating the first side from the second side and extending from a first peak to a second peak, the troughs and peaks extending in parallel and defining a longitudinal direction. Each first peak is formed with at least one depression, the depressions in respective peaks being aligned to form at least one tube-receiving channel extending transversely to the longitudinal direction. Each depression has a contact surface formed in the first side and extending laterally over each adjacent first trough. A tube section is received in each tube-receiving channel in substantially conforming contact with the contact surfaces.