Patents by Inventor Bradley Rechichar

Bradley Rechichar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10851049
    Abstract: The present disclosure provides a curable composition containing a benzoxazine, reactive diluent and a soluble polyimide. The curable composition, upon curing, renders an article having well balanced thermal, chemical and mechanical properties and may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: December 1, 2020
    Assignee: HUNTSMAN ADVANCED MATERIALS AMERICAS LLC
    Inventors: Dong Le, Derek Kincaid, Dong Wang, Bradley Rechichar
  • Patent number: 10494520
    Abstract: The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: December 3, 2019
    Assignee: HUNTSMAN ADVANCED MATERIALS AMERICAS LLC
    Inventors: Dong Wang, Bradley Rechichar, Derek S. Kincaid, Ronald C. Smith, Jr.
  • Publication number: 20180186730
    Abstract: The present disclosure provides a curable composition containing a benzoxazine, reactive diluent and a soluble polyimide. The curable composition, upon curing, renders an article having well balanced thermal, chemical and mechanical properties and may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.
    Type: Application
    Filed: July 20, 2016
    Publication date: July 5, 2018
    Inventors: Dong Le, Derek Kincaid, Dong Wang, Bradley Rechichar
  • Publication number: 20180030264
    Abstract: The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130°-140° C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.
    Type: Application
    Filed: March 4, 2016
    Publication date: February 1, 2018
    Inventors: Dong Wang, Bradley Rechichar, Derek S. Kincaid, Ronald C. Smith
  • Publication number: 20170008994
    Abstract: The present disclosure provides a hybrid benzoxazine resin and a method for producing such a resin by reacting an aldehyde compound and an organic primary monoamine with a multifunctional phenol monomer and a monofunctional phenol monomer in the presence or absence of a solvent. The hybrid benzoxazine resin may be easily recovered and provides a resin that is substantially monofunctional phenol-free and therefore useful in a variety of applications and products, such as in aerospace and transportation interior applications and products.
    Type: Application
    Filed: February 10, 2015
    Publication date: January 12, 2017
    Inventors: Dong Wang, Derek S Kincaid, Ronald C Smith, Jr., Bradley Rechichar