Abstract: A universal vehicle electric power distribution module employs reconfigurable inputs and outputs enabling use of the same hardware across vehicle lines. The module is scalable for ease of expansion and is capable of handling both low current and high current load management on the same module.

Abstract: A universal vehicle electric power distribution module employs reconfigurable inputs and outputs enabling use of the same hardware across vehicle lines. The module is scalable for ease of expansion and is capable of handling both low current and high current load management on the same module.

Abstract: A heat sink assembly to remove heat from electrical components mounted on a circuit board is disclosed. The assembly contains a housing that is formed from a suitable heat sinking material and is appropriate for receiving a circuit board with surface mounted electrical components. The invention provides an improved apparatus for establishing thermal contact from a heat generating, surface mounted electrical component to the housing. A resilient biasing element is fixed in relation to the circuit board and the housing in order to urge the circuit board with a plurality of surface mounted electrical components in thermal contact with the housing. Once the heat sink is assembled the invention provides various means for which heat can be readily transferred from the electrical components to the housing.

Abstract: A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical components are held in relation to a module housing. The module housing, generally, not only provides support but also acts as a heat sink for heat generating electrical components. The electrical components are covered by a potting compound. The potting compound protects the electrical components from dust or any other particles that could affect the function of the electrical component. The present invention discloses a heat sinking module cover with a support portion and a thermal transfer portion. The heat sinking module cover is positioned with respect to the module housing to form a box-like structure. The thermal transfer portion contacts the potting material directly to provide an additional heat sinking means for the electronic module assembly.

Abstract: An automobile instrument cluster assembly includes a printed circuit board and a display unit coupled to the circuit board. The display unit includes a light source for displaying information. The instrument cluster further includes a switch having a depressible push-button moveable between an ON position and an OFF position for interacting with the displayed information. The instrument cluster further includes a switch actuator assembly having a plunger for moving the push-button between the ON and OFF positions. The switch actuator assembly further includes a plunger support member removably attached to the circuit board in a snap-fit arrangement for movably supporting the plunger.

Abstract: A load spring for heat sink assemblies has an elongated body with a plurality of fingers, spring arms and a positioning mechanism extending from the body. Also, a wedge bar tensions and maintains the spring in a heat sink housing. The fingers apply a force onto the electrical components to clamp the electrical components against the heat sink housing to provide heat dissipation from the electrical components to the housing.