Abstract: A cleaning device for cleaning substrates is provided. The cleaning device includes a generally cylindrically-shaped brush mandrel and a cylindrical brush. The brush mandrel has a body section with an outer surface positioned about a central axis. The outer surface is interrupted by an engagement member having primary features adjacent secondary features. The brush has a hollow bore formed around the brush mandrel with an inner surface interrupted by a second engagement member which mates the first engagement member. The primary features flow in a direction generally perpendicular to a rotational direction of the brush mandrel around the central axis and include a first surface which is generally perpendicular to the outer surface. The secondary features include a second surface which flows in a direction generally perpendicular to the first surface and along the central axis. No primary feature includes a radially obstructing feature formed over any secondary feature.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

Abstract: A cleaning device for cleaning substrates is provided. The device comprises a cleaning brush having an outer cleaning surface surrounding a hollow bore and positioned around a first central axis al defining a first rotational direction ?; and a plurality of cantilevered nodules formed on the outer cleaning surface, each nodule having a mounting portion connected with the outer cleaning surface, a cleaning portion connected with the mounting portion, and a contact member for engaging the substrate. The cleaning portion extends in a first direction D1 from the mounting portion to the contact member, wherein a radial direction Dr is defined as extending radially from the central axis a1 towards the outer cleaning surface and normal to the rotational direction ?, and wherein the first direction D1 intersects with the radial direction Dr at an angle ?. Angle ? is greater than 0° and less than 180°.

Abstract: A cleaning device for cleaning substrates is provided. The cleaning device includes a generally cylindrically-shaped brush mandrel and a cylindrical brush. The brush mandrel has a body section with an outer surface positioned about a central axis. The outer surface is interrupted by an engagement member having primary features adjacent secondary features. The brush has a hollow bore formed around the brush mandrel with an inner surface interrupted by a second engagement member which mates the first engagement member. The primary features flow in a direction generally perpendicular to a rotational direction of the brush mandrel around the central axis and include a first surface which is generally perpendicular to the outer surface. The secondary features include a second surface which flows in a direction generally perpendicular to the first surface and along the central axis. No primary feature includes a radially obstructing feature formed over any secondary feature.

Abstract: A cleaning device for cleaning substrates is provided. The cleaning device includes a generally cylindrically-shaped brush mandrel and a cylindrical brush. The brush mandrel has a body section with an outer surface positioned about a central axis. The outer surface is interrupted by an engagement member having primary features adjacent secondary features. The brush has a hollow bore formed around the brush mandrel with an inner surface interrupted by a second engagement member which mates the first engagement member. The primary features flow in a direction generally perpendicular to a rotational direction of the brush mandrel around the central axis and include a first surface which is generally perpendicular to the outer surface. The secondary features include a second surface which flows in a direction generally perpendicular to the first surface and along the central axis. No primary feature includes a radially obstructing feature formed over any secondary feature.

Abstract: A cleaning device for cleaning substrates is provided. The cleaning device includes a generally cylindrically-shaped brush mandrel and a cylindrical brush. The brush mandrel has a body section with an outer surface positioned about a central axis. The outer surface is interrupted by an engagement member having primary features adjacent secondary features. The brush has a hollow bore formed around the brush mandrel with an inner surface interrupted by a second engagement member which mates the first engagement member. The primary features flow in a direction generally perpendicular to a rotational direction of the brush mandrel around the central axis and include a first surface which is generally perpendicular to the outer surface. The secondary features include a second surface which flows in a direction generally perpendicular to the first surface and along the central axis. No primary feature includes a radially obstructing feature formed over any secondary feature.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

Abstract: A cleaning device for cleaning a substrate is provided. In one aspect, the cleaning device includes a brush including a first end, a second end opposed to the first end, an outer surface, and a hollow bore defined in the brush about a central axis of the brush. The brush defines a first cross-sectional area near the first end and a second cross-sectional area near the second end. Both the first and second cross-sectional areas are generally perpendicular to the central axis and the second cross-sectional area is greater than the first cross-sectional area.

Abstract: Cleaning devices and methods for cleaning substrates are provided. In one aspect, a cleaning device for cleaning a substrate includes a brush including an outer surface and defines a hollow bore positioned around a central axis of the brush, and nodules formed on the outer surface of the brush and each nodule includes a concave surface. Each concave surface defines an outer edge surrounding a central concavity point. In another aspect, a method for cleaning a substrate includes engaging a substrate with a cleaning device. The cleaning device includes a brush including an outer surface and defines a hollow bore positioned around a first axis of the brush, and nodules formed on the outer surface and each nodule includes a concave surface. Each concave surface defines an outer edge surrounding a central concavity point. The method also includes rotating the brush about the first axis in a first rotational direction.

Abstract: A cleaning device for cleaning substrates is provided. The device comprises a cleaning brush having an outer cleaning surface surrounding a hollow bore and positioned around a first central axis al defining a first rotational direction ?; and a plurality of cantilevered nodules formed on the outer cleaning surface, each nodule having a mounting portion connected with the outer cleaning surface, a cleaning portion connected with the mounting portion, and a contact member for engaging the substrate. The cleaning portion extends in a first direction D1 from the mounting portion to the contact member, wherein a radial direction Dr is defined as extending radially from the central axis a1 towards the outer cleaning surface and normal to the rotational direction ?, and wherein the first direction D1 intersects with the radial direction Dr at an angle ?. Angle ? is greater than 0° and less than 180°.

Abstract: A cleaning device for cleaning substrates is provided. The cleaning device includes a generally cylindrically-shaped brush mandrel and a cylindrical brush. The brush mandrel has a body section with an outer surface positioned about a central axis. The outer surface is interrupted by an engagement member having primary features adjacent secondary features. The brush has a hollow bore formed around the brush mandrel with an inner surface interrupted by a second engagement member which mates the first engagement member. The primary features flow in a direction generally perpendicular to a rotational direction of the brush mandrel around the central axis and include a first surface which is generally perpendicular to the outer surface. The secondary features include a second surface which flows in a direction generally perpendicular to the first surface and along the central axis. No primary feature includes a radially obstructing feature formed over any secondary feature.

Abstract: A method for improving the reliability of integrated circuits. In one embodiment, the method includes forming a dielectric layer on a semiconductor wafer. A trench is then formed in the dielectric. Thereafter, a conductive interconnect is formed within the trench, wherein the conductive interconnect comprises copper. The conductive interconnect is then etched using an acidic solution. Lastly, a conductive layer is formed on an exposed surface of the etched conductive interconnect.

Abstract: Reducing CMP wafer contamination by in-situ clean is disclosed herein. The invention can be employed in a method in which a conductive layer is formed on a surface of a semiconductor wafer. After a portion of the conductive layer is removed, an acidic solution is directly or indirectly applied to the semiconductor wafer. Then the semiconductor wafer is engaged with a polishing pad as the acidic solution is applied directly or indirectly to the semiconductor wafer. In one embodiment, the portion of the conductive layer is removed by a CMP tool, and the semiconductor wafer is engaged with the polishing pad before the semiconductor is removed from the CMP tool.

Abstract: A method and system for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, the system includes an arm having a delivery portion disposed at least partially over the polishing surface. A first nozzle and a second nozzle are disposed on the delivery portion of the arm. The first nozzle is adapted to flow the polishing fluid at a first rate while the second nozzle is adapted to flow the polishing fluid at a second rate that is different than the first rate. A method for delivering a polishing fluid to a chemical mechanical polishing surface generally includes the steps of supplying the polishing fluid to a semiconductor polishing surface in one location at a first rate and providing the polishing fluid to the polishing surface at a second location at a second rate which is different than the first rate.