Patents by Inventor Bradley Schipper

Bradley Schipper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11168476
    Abstract: An ultra high performance concrete (UHPC) voided slab panel may include a top slab including a top skin and a bottom slab including a bottom skin. The top slab and the bottom slab may be joined at a joint filled with a joint material and positioned a select height within the UHPC voided slab panel. The top slab and the bottom slab may be joined via a connector assembly. The panel may include least two ribs defining at least one void accessible via at least one opening through an exterior surface of the UHPC voided slab panel. The UHPC voided slab panel may be fabricated from UHPC and a plurality of embedded prestressing strands, and may be configured to meet select strength requirements that are greater than select strength requirements for conventional precast concrete without reinforcing bars being embedded within the UHPC voided slab panel.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: November 9, 2021
    Assignee: e.Construct.USA, LLC
    Inventors: Maher K. Tadros, Micheal Asaad, Bradley Schipper