Abstract: Described is an in-band full-duplex (IBFD) antenna having direction finding capability. The IBFD antenna includes a transmit antenna having an omnidirectional radiation pattern and a receive antenna configured to provide a plurality of difference beams. The IBFD antenna may be disposed on a moving platform to cover all angles around the moving platform.

Abstract: A network device includes a transceiver configured to concurrently transmit signals and receive signals within a single frequency band resulting in radio-frequency signal interference. The device includes an analog canceler configured to mitigate the signal interference. The device includes a neural network that receives data that describes characteristics of the signal interference and provides coefficients for the analog canceler as outputs. The neural network-generated coefficients are applied to the analog canceler which uses them to cancel the signal interference.

Abstract: A network device includes a transceiver configured to concurrently transmit signals and receive signals within a single frequency band resulting in radio-frequency signal interference. The device includes an analog canceler configured to mitigate the signal interference. The device includes a neural network that receives data that describes characteristics of the signal interference and provides coefficients for the analog canceler as outputs. The neural network-generated coefficients are applied to the analog canceler which uses them to cancel the signal interference.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.

Abstract: A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.