Abstract: Diamond is used as an electrically insulating substrate in multi-layer devices. In a transformer, the first electrical conductor forms a coil. The first electrical conductor is formed in a plurality of layers. Electrical carriers are formed on a layer to make an electrical path around a core of ferrous material. The second conductor forms a second coil of the transformer and also wraps around the core of ferrous material. Using diamond is advantageous in a transformer since the diamond is very effective at transferring heat from the core. The diamond also electrically insulates the various portions of the transformer. An electronic packaging concept includes mounting one or more electronic components to a substrate including a layer of diamond. The layer of diamond is sufficient to transfer heat from the one or more electronic components attached to the diamond substrate. The entire substrate can also be made of diamond.

Abstract: An apparatus for electrically connecting a plurality chips to a circuit board includes a pair of ceramic chip carriers that have flexible circuits connected to the electrical contact locations on each ceramic chip. The apparatus for electrically connecting a plurality chips to a circuit board may also include an area between two chip connect surfaces which has multiple metallization layers isolated from one another by flexible isolation material. A flexible circuit extends beyond the edge of the ceramic chip or the chip-connect area and forms a flap. The flexible circuit flap includes electrical paths to pads on the chip-connect area of the device. Each flap portion of the flexible circuit has a set of pads. The pads on the flaps of the first and second ceramic chips are positioned to connect to a third set of pads on a printed circuit board. The printed circuit board is provided with pads positioned so that the pads on the flaps will correspond to the pads on the flaps of the ceramic chips.

Abstract: An interconnection device has a multiplicity of individual arms attached to a carrier board. The carrier board includes vias which go through the board and have a pad on the top and bottom of the board near the via. Attached to each via pad is an arm. The arm is attached so that its free end extends out over the clearance hole in the carrier board. The free end of the arm positioned over the clearance hole includes a surface treatment which allows the free end to make good electrical contact with a mating device. Each of the arms is positioned so that it corresponds to the pads on the device to which it will connect. Each of the arms acts as a cantilevered beam. The arms are deflected. The geometry, material, material temper, and surface plating allow for a very low overall force having to be applied to the interconnection in order to provide good electrical contact between the first module and second module being interconnected. The amount of compliance may be 10 to 12 mils.

Abstract: The invention is a computer module for scalably adding computing power and cooling capacity to a computer system. Computing power can be added by merely adding additional printed circuit cards to the computing module. Cooling capability is added by adding heat pipes to the computer module. The computing module for a computer includes a first heat pipe assembly. The first heat pipe assembly has an evaporator plate with an evaporator surface. The first heat pipe also has a condenser in fluid communication with the evaporator plate. The evaporator plate is positioned adjacent one side of a printed circuit board populated with at least one electronic component. The computing module may use a printed circuit board which has two sides populated with electronic components.

Abstract: An air distribution system for electronic components utilizes an air supply unit with a silencer unit. The silencer unit attenuates sound associated with the air unit blowers with inlet and discharge silencers. The blowers have check valves which provide for isolating each blower for continued operation even with one blower. The cooling air is transported to a circuit board module stack from the blowers through ducts and a bank of rod valves. The valves allow maximum air flow to the modules with minimum resistance. The ducts have a flexible portion which have quick disconnects and act to isolate the modules from vibrations and static. The modules utilize channels in an air plate with different sized baffles to provide even distribution of cooling air to the printed circuit boards.

Abstract: In a cooling system, an air manifold provides an equalized static pressure so that the air manifold evenly distributes air in a uniform basis without varying static pressures and volumes at each chip site on a printed circuit board. The air manifold is also distributes this air at the lowest possible volume so that the pumping energy required and the associated pumping noise are minimized.

Abstract: A monitoring system for printed circuit boards which are air-cooled utilizes temperature sensors which have thermal diodes embedded directly into the integrated circuits. The thermal diodes are part of the fully-functioning integrated circuit which utilize voltages on the board for driving so that no added power sources are required. The thermal diode has a voltage which is inversely proportional to the temperature and can be calibrated so that a given voltage can be converted into a given temperature. This can be utilized by a logic controller to monitor and control cooling. Pressure sensors are also used with the temperature sensors to monitor air pressure along the ducts leading to the printed circuit boards. Pressure sensors also utilize voltages from the board for driving and have an amplification circuit to increase the signal. The pressure reading can also be utilized by a logic controller for controlling and monitoring the cooling of the boards.

Abstract: A monitoring system for printed circuit boards which are air-cooled utilizes temperature sensors which have thermal diodes embedded directly into the integrated circuits. The thermal diodes are part of the fully-functioning integrated circuit which utilize voltages on the board for driving so that no added power sources are required. The thermal diode has a voltage which is inversely proportional to the temperature and can be calibrated so that a given voltage can be converted into a given temperature. This can be utilized by a logic controller to monitor and control cooling. Pressure sensors are also used with the temperature sensors to monitor air pressure along the ducts leading to the printed circuit boards. Pressure sensors also utilize voltages from the board for driving and have an amplification circuit to increase the signal. The pressure reading can also be utilized by a logic controller for controlling and monitoring the cooling of the boards.

Abstract: An air manifold mounted adjacent to a circuit board for directing air jets onto electronic devices mounted on the circuit board. The air manifold has an air inlet and a plurality of outlet nozzles positioned along the channel for directing air onto the electronic devices. A plurality of members are positioned next to the nozzles with the members increasing in length as the distance between the inlet and the outlets increase.

Abstract: A high reliability, non-blocking air filter for filtering large volumes of low pressure air from equipment to be maintained free of dust and impurities while being ventilated during operation is disclosed. The filter media is mounted in a frame having a U-shaped cross section construction, which is attached over an air intake opening of the piece of equipment. The filter media includes a planar base surface and a plurality of projections. The tops of the projections define a surface above said planar base surface for supporting free-flowing articles so as such that these articles do not obstruct the air flow through the air intake filter.

Abstract: An air-jet impingement cooling method combined with a miniature pin-fin heat sink provides equivalent fluid flow to each IC package in a module and achieves a high heat transfer rate per volume. The packaging design is comparable to high-density packaging systems utilizing low-temperature coolant.