Abstract: Systems and methods are provided for selectively removing unwanted material from a surface of a semiconductor wafer without causing damage to or etching of underlying portions of the semiconductor. One embodiment of the invention includes the use of reactive species from a plasma source to facilitate the removal of residues remaining after metal etching on a silicon wafer, where the gases employed in creating the plasma include hydrogen, halogens such as fluorine, and little or no oxygen.

Abstract: A superconducting electronic circuit device, useful when impedance matching is desired, especially suited to microwave frequencies, consisting of a thin dielectric layer with superconducting layers on both sides. A superconductor such as Yttrium Barium Copper Oxide (YBCO) is formed on a first substrate such as lanthanum aluminate. A protective layer like gold is deposited on the YBCO and a second carrier substrate is bonded to the protected YBCO. The first substrate is then thinned into a thin dielectric film and a second layer of superconductor is epitaxially grown thereon to create the desired circuits.