Abstract: Embodiments disclosed herein include potassium sodium niobate (KNN) films and methods of making such films. In an embodiment, a method of forming a potassium sodium niobate (KNN) film comprises preparing a solution comprising water, potassium hexaniobate salts, and sodium hexaniobate salts. In an embodiment, the solution is spin coated onto a substrate to form a film on at least a portion of a surface of the substrate. In an embodiment, the method may further comprise heat treating the film.

Abstract: Embodiments disclosed herein include potassium sodium niobate (KNN) films and methods of making such films. In an embodiment, a method of forming a potassium sodium niobate (KNN) film comprises preparing a solution comprising water, potassium hexaniobate salts, and sodium hexaniobate salts. In an embodiment, the solution is spin coated onto a substrate to form a film on at least a portion of a surface of the substrate. In an embodiment, the method may further comprise heat treating the film.

Abstract: An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.

Abstract: A piezoelectric thin film device comprises a piezoelectric thin film having upper and lower surfaces and a defined tilted crystal morphology, a top electrode disposed on the upper surface, a substrate having a surface morphology that corresponds to the defined crystallographically tilted morphology, and a bottom electrode disposed between and crystallographically linked to both the lower surface of the piezoelectric thin film and the substrate surface, the bottom and top electrodes having a parallel planar configuration relative to the plane of the substrate and the defined crystallographically tilted morphology having a crystallographic c-axis direction oriented at a >0° angle relative to the normal to the plane of the electrodes; and method of making the device.

Abstract: An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.

Abstract: A piezoelectric thin film device comprises a piezoelectric thin film having upper and lower surfaces and a defined tilted crystal morphology, a top electrode disposed on the upper surface, a substrate having a surface morphology that corresponds to the defined crystallographically tilted morphology, and a bottom electrode disposed between and crystallographically linked to both the lower surface of the piezoelectric thin film and the substrate surface, the bottom and top electrodes having a parallel planar configuration relative to the plane of the substrate and the defined crystallographically tilted morphology having a crystallographic c-axis direction oriented at a >0° angle relative to the normal to the plane of the electrodes; and method of making the device.

Abstract: An electronic structure comprising: (a) a first metal layer; (b) a second metal layer; (c) and at least one insulator layer located between the first metal layer and the second metal layer, wherein at least one of the metal layers comprises an amorphous multi-component metallic film. In certain embodiments, the construct is a metal-insulator-metal (MIM) diode.

Abstract: A dielectric composite material comprising at least two crystal phases of different components with TiO2 as a first component and a material selected from the group consisting of Ba1−xSrxTiO3 where x is from 0.3 to 0.7, Pb1−xCaxTiO3 where x is from 0.4 to 0.7, Sr1−xPbxTiO3 where x is from 0.2 to 0.4, Ba1−xCdxTiO3 where x is from 0.02 to 0.1, BaTi1−xZrxO3 where x is from 0.2 to 0.3, BaTi1−xSnxO3 where x is from 0.15 to 0.3, BaTi1−xHfxO3 where x is from 0.24 to 0.3, Pb1−1.3xLaxTiO3+0.2x where x is from 0.23 to 0.3, (BaTiO3)x(PbFeo0.5Nb0.5O3)1−x where x is from 0.75 to 0.9, (PbTiO3)−(PbCo0.5W0.5O3)1−x where x is from 0.1 to 0.45, (PbTiO3)x(PbMg0.5W0.5O3)1−x where x is from 0.2 to 0.4, and (PbTiO3)x(PbFe0.5Ta0.5O3)1−x where x is from 0 to 0.2, as the second component is described. The dielectric composite material can be formed as a thin film upon suitable substrates.

Abstract: A dielectric composite material comprising at least two crystal phases of different components with TiO2 as a first component and a material selected from the group consisting of Ba1−xSrxTiO3 where x is from 0.3 to 0.7, Pb1−xCaxTiO3 where x is from 0.4 to 0.7, Sr1−xPbxTiO3 where x is from 0.2 to 0.4, Ba1−xCdxTiO3 where x is from 0.02 to 0.1, BaTi1−xZrxO3 where x is from 0.2 to 0.3, BaTi1−xSnxO3 where x is from 0.15 to 0.3, BaTi1−xHfxO3 where x is from 0.24 to 0.3, Pb1-1.3xLaxTiO3+0.2x where x is from 0.23 to 0.3, (BaTiO3)x(PbFe0.5Nb0.5O3)1−x where x is from 0.75 to 0.9, (PbTiO3)x(PbCo0.5W0.5O3)1−x where x is from 0.1 to 0.45, (PbTiO3)x(PbMg0.5W0.5O3)1−x where x is from 0.2 to 0.4, and (PbTiO3)x(PbFe0.5Ta0.5O3)1−x where x is from 0 to 0.2, as the second component is described. The dielectric composite material can be formed as a thin film upon suitable substrates.