Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.

Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

Abstract: A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.

Abstract: A laser processes a workpiece with laser pulses delivered at random time intervals and at substantially constant energy levels by characterizing the laser cavity discharge behavior and utilizing that information for adjusting dummy pulse time periods to compensate for the energy errors. Dummy pulses are laser pulses that are blocked from reaching a workpiece. A second way for providing constant pulse energies employs an AOM for varying amounts of laser energy passed to the workpiece. A third way of providing constant pulse energies entails extending the pulse period of selected pulses to allow additional laser cavity charging time whenever a dummy pulse is initiated.

Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

Abstract: A laser processes a workpiece with laser pulses delivered at random time intervals and at substantially constant energy levels by characterizing the laser cavity discharge behavior and utilizing that information for adjusting dummy pulse time periods to compensate for the energy errors. Dummy pulses are laser pulses that are blocked from reaching a workpiece. A second way for providing constant pulse energies employs an AOM for varying amounts of laser energy passed to the workpiece. A third way of providing constant pulse energies entails extending the pulse period of selected pulses to allow additional laser cavity charging time whenever a dummy pulse is initiated.

Abstract: A laser processes a workpiece with laser pulses delivered at random time intervals and at substantially constant energy levels by characterizing the laser cavity discharge behavior and utilizing that information for adjusting dummy pulse time periods to compensate for the energy errors. Dummy pulses are laser pulses that are blocked from reaching a workpiece. A second way for providing constant pulse energies employs an AOM for varying amounts of laser energy passed to the workpiece. A third way of providing constant pulse energies entails extending the pulse period of selected pulses to allow additional laser cavity charging time whenever a dummy pulse is initiated.

Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

Abstract: A method of suppressing distortion of a working laser beam directed for incidence on a target specimen presented for processing by a laser link processing system uses a spatial filter to remove stray light-induced distortion from the working laser beam.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.

Abstract: A method and system decrease the amount of undesired laser radiation reaching a workpiece from a laser having a laser cavity and a Q-switch. The laser operates at any given time in one of at least two modes. In a first mode the laser emits pulses at a PRF (pulse repetition frequency) for selectively irradiating targets on or within a workpiece, and the pulses propagate along a propagation path to the workpiece. In a second mode less or no laser radiation desirably reaches the workpiece. The method is operable during the second mode. The method opens the Q switch more than the Q switch is open in the first mode, thereby limiting the amount of energy that builds up in the laser cavity and decreasing the peak energy of the laser radiation emitted in the second mode.

Abstract: Preferred embodiments of a purge gas port, laser beam attenuating input window, and laser shutter constitute subsystems of a UV laser optical system in which a laser beam is completely enclosed to reduce contamination of the optical system components. Purge gas is injected through multiple locations in a beam tube assembly to ensure that the optical component surfaces sensitive to contamination are in the flow path of the purge gas. The input window functions as a fixed level attenuator to limit photopolymerization of airborne molecules and particles. Periodically rotating optical elements asymmetrically in their holders reduces burn damage to the optics.

Abstract: A method of suppressing distortion of a working laser beam directed for incidence on a target specimen presented for processing by a laser link processing system uses a spatial filter to remove stray light-induced distortion from the working laser beam.

Abstract: A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The system comprises a laser source, first and second laser beam propagation paths, first and second reflection sensors, and a processor. The laser source produces at least the first and second laser beams, which propagate toward the substrate along the first and second propagation paths, respectively, which have respective first and second axes that intersects the substrate at respective first and second spots. The reflection sensors are positioned to detect reflection of the spots, as the spots moves relative to the substrate, thereby generating reflection signals. The processor is configured to determine, based on the reflection signals, positions of the spots on or within the substrate.

Abstract: A method and system decrease the amount of undesired laser radiation reaching a workpiece from a laser having a laser cavity and a Q-switch. The laser operates at any given time in one of at least two modes. In a first mode the laser emits pulses at a PRF (pulse repetition frequency) for selectively irradiating targets on or within a workpiece, and the pulses propagate along a propagation path to the workpiece. In a second mode less or no laser radiation desirably reaches the workpiece. The method is operable during the second mode. The method opens the Q switch more than the Q switch is open in the first mode, thereby limiting the amount of energy that builds up in the laser cavity and decreasing the peak energy of the laser radiation emitted in the second mode.

Abstract: A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs positioned such that the laser beam passes through the AOMs without being deflected. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head.

Abstract: A laser processes a workpiece with laser pulses delivered at random time intervals and at substantially constant energy levels by characterizing the laser cavity discharge behavior and utilizing that information for adjusting dummy pulse time periods to compensate for the energy errors. Dummy pulses are laser pulses that are blocked from reaching a workpiece. A second way for providing constant pulse energies employs an AOM for varying amounts of laser energy passed to the workpiece. A third way of providing constant pulse energies entails extending the pulse period of selected pulses to allow additional laser cavity charging time whenever a dummy pulse is initiated.