Patents by Inventor Brain J. O'Hara

Brain J. O'Hara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming sputter target assemblies having a controlled solder thickness
    Publication number: 20080006528
    Abstract: The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 10, 2008
    Inventors: Paul S. Gilman, Binu Mathew, Brain J. O'Hara, Thomas J. Hunt, Peter McDonald, Holger J. Koenigsmann