Abstract: A computer system with thermal management includes a boiler tank and a first computer component on a substrate in the boiler tank. A cooling fluid is positioned in the boiler tank and covering the first computer component. The boiler tank has a length, width, and height where the length and width of the boiler tank define a tank area that is no more than 50% larger than the substrate area.

Abstract: An electrical connector for transmitting electrical power includes at least one power pin with an ablative tip. The power pin has a body oriented in a direction of a longitudinal axis, and the ablative tip is at a terminal end along the longitudinal axis. The ablative tip includes a terminal edge and a support material positioned on a transverse side of the terminal edge that provides structural support to the terminal edge.

Abstract: Air quality inside a computing device is monitored utilizing an air quality monitor that can be sized to simulate a server computing device and can have multiple sensing equipment mounted inside, including equipment to detect corrosive aspects in the air and condensation sensing equipment to detect instances in which condensation can form on computing device hardware. Corrosion sensing can include metallic members that can be electrically coupled to voltage that can induce a current within the metallic members, thereby more accurately simulating the corrosion of operating PCBs. Condensation sensing can include condensation hosting members that can have a thermal mass that is approximately equal to the thermal mass of PCBs and can include heating elements by which the condensation hosting members can more accurately simulate the thermal effects and aspects of operating PCBs, and also moisture detectors, including electrical and optical moisture detectors. Additionally, an off-gassing chamber can be included.

Abstract: A rack acclimating device can accelerate the acclimation of an already assembled rack of computing equipment to an environment. A rack acclimating device can comprise one or more heating elements and an air moving device that can be oriented to move air across the heating elements and then through the rack of computing equipment. Additionally, the rack acclimating device can comprise a controller or other like computing device that can receive environmental sensor data and, based upon the received environmental sensor data, can control the heating elements and air moving device. Environmental sensor data can be received from environmental sensors, such as temperature and/or humidity sensors, which can be positioned to sense various environmental aspects. A rack acclimating device can also comprise a hood or other like structure to confine and direct the heated air from the heating elements and/or air moving device to the computer equipment rack.

Abstract: Air quality inside a computing device is monitored utilizing an air quality monitor that can be sized to simulate a server computing device and can have multiple sensing equipment mounted inside, including equipment to detect corrosive aspects in the air and condensation sensing equipment to detect instances in which condensation can form on computing device hardware. Corrosion sensing can include metallic members that can be electrically coupled to voltage that can induce a current within the metallic members, thereby more accurately simulating the corrosion of operating PCBs. Condensation sensing can include condensation hosting members that can have a thermal mass that is approximately equal to the thermal mass of PCBs and can include heating elements by which the condensation hosting members can more accurately simulate the thermal effects and aspects of operating PCBs, and also moisture detectors, including electrical and optical moisture detectors. Additionally, an off-gassing chamber can be included.

Abstract: A system includes a battery, a thermally-conductive element in thermal communication with the battery, a housing defining an internal volume, the internal volume including the battery and a first end of the thermally-conductive element, and a heat dissipation unit disposed outside of the internal volume, where a second end of the thermally-conductive element is disposed outside of the internal volume and is in thermal communication with the heat dissipation unit.

Abstract: Aspects extend to methods, systems, and computer program products for balancing input phases across server rack power supplies. A rack manager can monitor individual Alternating Current (AC) phase currents at the rack level. The rack manager knows (or can at least determine) which power supplies are connected to which phase. The rack manager can micro adjust individual PSU output voltages to balance current phases at the rack level. Balancing can occur in response to changed server workloads, hot-unplug of one or more servers, etc. When there is one PSU per server, phase balancing can be accomplished by connecting outputs of power supplies together via busbar or wire. Output voltages of individual power supplies can be adjusted to achieve better phase balancing. Phase imbalance can be corrected by a bus bar or wire carrying enough load to correct phase imbalance.

Abstract: Aspects extend to methods, systems, and computer program products for balancing input phases across server rack power supplies. A rack manager can monitor individual Alternating Current (AC) phase currents at the rack level. The rack manager knows (or can at least determine) which power supplies are connected to which phase. The rack manager can micro adjust individual PSU output voltages to balance current phases at the rack level. Balancing can occur in response to changed server workloads, hot-unplug of one or more servers, etc. When there is one PSU per server, phase balancing can be accomplished by connecting outputs of power supplies together via busbar or wire. Output voltages of individual power supplies can be adjusted to achieve better phase balancing. Phase imbalance can be corrected by a bus bar or wire carrying enough load to correct phase imbalance.

Abstract: Baffles separate cooling air into layers and then reduce or prevent mixing of cooling air with air that has been heated by thermal contact with electronic components mounted on a printed circuit board (PCB). Some baffles include an exhaust chamber surface with an exhaust outlet and at least one passage exit. A plurality of cooling chamber surfaces define cooling chambers. Each cooling chamber surface has an inlet for cooling air, an electronics component threshold for pulling heat into the air from the electronic components, and at least one exhaust for heated air. Exhaust passages may connect a cooling chamber to the exhaust chamber; cooling chambers may also exhaust warmed air directly. Chamber surfaces may be parallel, or angled, relative to the PCB. Thresholds may be open, or closed but thermally conductive. Moving parts are not necessarily required in a baffle. Air temperature and flow may be sensed and acted upon.

Abstract: Management of infrastructure devices is performed by computing devices that are associated with the processing being provided by the data center, such as chassis managers. A master is first selected through polling or consensus algorithms, and then subsequently the master is endowed with the authority to manage infrastructure devices and generate the control output to such infrastructure devices. Alternatively, no master need be elected and, instead, output to such infrastructure devices is generated by a computing device selected utilizing polling or consensus algorithms, and in accordance with a management decision made through polling or consensus algorithms. The interplay between the cooling apparatuses of individual server computing devices and the cooling apparatuses of the data center as a whole is also managed to increase the portion of the cooling of server computing devices provided by data center air movers. Control of data center air movers can be determined empirically or predictively.

Abstract: A self-powered processing device comprises both a processing device and a power generator that are physically, electrically, and thermally coupled to one another. The power generator can be a fuel cell that can be manufactured from materials that can also support processing circuitry, such as silicon-based materials. A thermal coupling between the power generator and the processing device can include a thermoelectric either generating electrical power from the temperature differential or consuming electrical power to generate a temperature differential. A computing device with self-powered processing devices also includes energy storage devices to store excess energy produced by the self-powered processing device and provide it back during times of need. The self-powered processing device comprises either a wireless or wired network connection, the latter being connectable to a slot on a backplane that can aggregate multiple self-powered processing devices and provide fuel delivery paths for them.

Abstract: A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally conductive interface with a liquid. The liquid's container can extend to a cooling apparatus located physically above such computing devices to provide hydronic convection cooling, or it can extend into the earth, either in the form of a heat pipe, or in the form of conduits through which the liquid is actively pumped. The hydronic convection cooling and geothermal heat pipe cooling operate via temperature differentials and consume no external electrical power. Geothermal cooling avoids heat soak by utilizing multiple different sets of conduits extending into the earth, where at least some of those sets of conduits are not utilized for a period of time. Combinations of hydronic convection mechanisms and geothermal cooling can also be utilized.

Abstract: A self-supporting server chassis accepts blade server computing devices, and other like computing devices and associated infrastructure hardware, and also provides structural support for vertical stacking of such self-supporting server chassis, thereby eliminating the need for conventional racks. Internal support structures, such as rails, holes and standoffs, accept and provide physical support for the computing devices and other infrastructure hardware. Vertical stacking support structures provide physical stability and rigidity for stacking multiple self-supporting server chassis in a vertical direction, and allow interconnection among self-supporting server chassis. Stacks of self-supporting server chassis can comprise a base member with casters or other like transportation hardware, as well as a top member that provides further structural stability and rigidity, as well as providing cooling and airflow benefits, such as airflow containment.

Abstract: Management of infrastructure devices is performed by computing devices that are associated with the processing being provided by the data center, such as chassis managers. A master is first selected through polling or consensus algorithms, and then subsequently the master is endowed with the authority to manage infrastructure devices and generate the control output to such infrastructure devices. Alternatively, no master need be elected and, instead, output to such infrastructure devices is generated by a computing device selected utilizing polling or consensus algorithms, and in accordance with a management decision made through polling or consensus algorithms. The interplay between the cooling apparatuses of individual server computing devices and the cooling apparatuses of the data center as a whole is also managed to increase the portion of the cooling of server computing devices provided by data center air movers. Control of data center air movers can be determined empirically or predictively.

Abstract: A self-supporting server chassis accepts blade server computing devices, and other like computing devices and associated infrastructure hardware, and also provides structural support for vertical stacking of such self-supporting server chassis, thereby eliminating the need for conventional racks. Internal support structures, such as rails, holes and standoffs, accept and provide physical support for the computing devices and other infrastructure hardware. Vertical stacking support structures provide physical stability and rigidity for stacking multiple self-supporting server chassis in a vertical direction, and allow interconnection among self-supporting server chassis. Stacks of self-supporting server chassis can comprise a base member with casters or other like transportation hardware, as well as a top member that provides further structural stability and rigidity, as well as providing cooling and airflow benefits, such as airflow containment.

Abstract: A data center is cooled through hydronic convection mechanisms, geothermal mechanisms or combinations thereof. The individual computing devices of such a data center are cooled through a thermally conductive interface with a liquid. The liquid's container can extend to a cooling apparatus located physically above such computing devices to provide hydronic convection cooling, or it can extend into the earth, either in the form of a heat pipe, or in the form of conduits through which the liquid is actively pumped. The hydronic convection cooling and geothermal heat pipe cooling operate via temperature differentials and consume no external electrical power. Geothermal cooling avoids heat soak by utilizing multiple different sets of conduits extending into the earth, where at least some of those sets of conduits are not utilized for a period of time. Combinations of hydronic convection mechanisms and geothermal cooling can also be utilized.

Abstract: A self-powered processing device comprises both a processing device and a power generator that are physically, electrically, and thermally coupled to one another. The power generator can be a fuel cell that can be manufactured from materials that can also support processing circuitry, such as silicon-based materials. A thermal coupling between the power generator and the processing device can include a thermoelectric either generating electrical power from the temperature differential or consuming electrical power to generate a temperature differential. A computing device with self-powered processing devices also includes energy storage devices to store excess energy produced by the self-powered processing device and provide it back during times of need. The self-powered processing device comprises either a wireless or wired network connection, the latter being connectable to a slot on a backplane that can aggregate multiple self-powered processing devices and provide fuel delivery paths for them.

Abstract: A parallel boost voltage power supply with local energy storage comprises a local energy storage and a local energy storage boost converter that boosts the voltage of the local energy storage and provides it to existing DC bulk storage circuitry. Diodes in series with the boost converter and an existing power factor correction boost converter enable the DC bulk storage circuitry to receive power from both the local energy storage and external power sources. Transition between local energy storage and external power sources is performed in a controlled manner to avoid overloading external power sources. Additionally, local energy storage devices are recharged from an existing isolation transformer circuit in the power supply if the power being drawn from external sources is below a threshold. Operation without external power is extended via communications with server computing devices resulting in decreased power consumption by deactivating components or throttling down processors.

Abstract: Systems, methodologies, and other embodiments are associated with a heat sink with a fin configured with a stator blade. One example includes a heat sink apparatus configured to experience a fan-assisted air flow. The example heat sink apparatus may be configured to include a fan that is configured to produce an air flow in the heat sink apparatus and a heat sink that houses the fan. The example heat sink may include a base and fins that are configured with stator blades.

Abstract: A cable management device includes a housing having a forward end, a rearward end, a base, opposing sidewalls, and a pair of vertically-spaced cross-members extending laterally within the housing between the sidewalls. A cable interconnecting electronic devices is routed forward and upwardly around the lower cross-member, rearwardly between the cross-members, rearward and upwardly around the upper cross-member and forwardly out of the housing forward end. The segment of cable extended out of the housing forward end may be pushed longitudinally along the segment back into the cable management device for stowage and subsequently extended back out of the device when needed.