Patents by Inventor BRANDON COURTNEY

BRANDON COURTNEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210292912
    Abstract: Coated Al—Li alloys, such as coated particles of Al—Li alloys, are provided. The coated alloys may be used in solid-rocket propellants. Additionally, methods of making such coated alloys, alloys coated with various methods, and solid-rocket propellants comprising such coated alloys are also provided.
    Type: Application
    Filed: July 23, 2019
    Publication date: September 23, 2021
    Applicant: Adranos Energetics LLC
    Inventors: Brandon Courtney Terry, Arrelaine A. Dameron, David M. King
  • Patent number: 11100032
    Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: August 24, 2021
    Assignee: Intel Corporation
    Inventors: David Browning, Brandon Courtney, John Eley
  • Publication number: 20200174959
    Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
    Type: Application
    Filed: February 3, 2020
    Publication date: June 4, 2020
    Applicant: Intel Corporation
    Inventors: David Browning, Brandon Courtney, John Eley
  • Publication number: 20200172321
    Abstract: A lining system for a cooler may include a waterproof container portion that defines an opening that has a generally cuboid shape and a volume of greater than 20 quarts. The bottom surface of the container portion as well as the walls of the container portion may be formed from a biodegradable polyester material. In addition, a drain tube may extend at least five inches from a wall of the container portion to allow a liquid collecting within the opening to drain from the waterproof container.
    Type: Application
    Filed: February 1, 2019
    Publication date: June 4, 2020
    Inventors: Russell W. White, Shawn A. Roberts, Laura J. Roberts, Brandon Courtney
  • Patent number: 10572430
    Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: February 25, 2020
    Assignee: Intel Corporation
    Inventors: David Browning, Brandon Courtney, John Eley
  • Publication number: 20190042516
    Abstract: An integrated circuit may include a printed circuit board and multiple processor sockets on the printed circuit board. Each of the multiple processor sockets is operable to receive a microprocessor and a programmable device. When a microprocessor is placed in a processor socket, that microprocessor may communicate with memory dual in-line memory modules (DIMMs). When a programmable device is placed in a processor socket, that programmable device may first be configured using a configuration DIMM and may then communicate with memory DIMMs during normal operation. The configuration DIMM may include multiple options for configuring the programmable device and may also provide additional management functions specifically tailored to the programmable device.
    Type: Application
    Filed: October 11, 2018
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: David Browning, Brandon Courtney, John Eley
  • Patent number: 10027160
    Abstract: A method is provided for forming a wireless charging electronic device. An embodiment of the method includes integrating a coil and a collector plate to a chassis of the electronic device to wirelessly charge the electronic device.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: July 17, 2018
    Assignee: Intel Corporation
    Inventors: Ralph V. Miele, David G. Payne, Brandon Courtney, Isaac A. Simpson, Andrew Larson, David Pidwerbecki, Patrick Chewning
  • Publication number: 20170279291
    Abstract: A method may be provided for forming a wireless charging electronic device. This may be performed by integrating a coil and a collector plate to a chassis of the electronic device.
    Type: Application
    Filed: March 25, 2016
    Publication date: September 28, 2017
    Inventors: Ralph V. MIELE, David G. PAYNE, Brandon COURTNEY, Isaac A. SIMPSON, Andrew LARSON, David PIDWERBECKI, Patrick CHEWNING
  • Publication number: 20160192544
    Abstract: In one example a electronic device comprises a housing, a circuit board comprising a plurality of heat generating components, a chassis, wherein the chassis comprises a cut-out section configured to receive the circuit board, an electromagnetic interference (EMI) shield is configured to cover the plurality of heat generating components on the circuit board and to be physically connected to the chassis, wherein the electromagnetic interference shield comprises at least one structural component. Other examples may be described.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 30, 2016
    Applicant: Intel Corporation
    Inventors: RUSSELL S. AOKI, MARK E. SPRENGER, HUE V. LAM, BRANDON COURTNEY, SHANTANU D. KULKARNI, DENICA N. LARSEN