Patents by Inventor Brandon E. Creager

Brandon E. Creager has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9786977
    Abstract: An example circuit board structure includes: a substrate; and vias that are electrically conductive and that pass through the substrate to enable electrical connection through the circuit board structure. The substrate is thinner, and lengths of the vias are shorter, in first areas of the circuit board structure that deliver first speed signals than in second areas of the circuit board structure that deliver second speed signals and power. The first speed signals have a shorter rise time than the second speed signals.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: October 10, 2017
    Assignee: Teradyne, Inc.
    Inventors: Timothy Daniel Lyons, Frank B. Parrish, Roger Allen Sinsheimer, Brian G. Donovan, Vladimir Vayner, Brandon E. Creager, Brian C. Wadell
  • Publication number: 20170170537
    Abstract: An example circuit board structure includes: a substrate; and vias that are electrically conductive and that pass through the substrate to enable electrical connection through the circuit board structure. The substrate is thinner, and lengths of the vias are shorter, in first areas of the circuit board structure that deliver first speed signals than in second areas of the circuit board structure that deliver second speed signals and power. The first speed signals have a shorter rise time than the second speed signals.
    Type: Application
    Filed: December 10, 2015
    Publication date: June 15, 2017
    Inventors: Timothy Daniel Lyons, Frank B. Parrish, Roger Allen Sinsheimer, Brian G. Donovan, Vladimir Vayner, Brandon E. Creager, Brian C. Wadell