Patents by Inventor Brandon GARY

Brandon GARY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Decoupled conduction/convection dual heat sink for on-board memory microcontrollers
    Patent number: 11013141
    Abstract: A heat sink may include a base having a first surface in a first plane configured to contact a system on chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include opposing internal walls that define a second spacing between the plurality of heat transfer members. The heat sink may include an enclosure surrounding the plurality of heat transfer members. The enclosure may include a base plate that contacts the base of the heat sink to form a cold-plate. The enclosure may partially surround the length of the heat transfer members, allowing airflow through the enclosure in a cross direction.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: May 18, 2021
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventor: Brandon Gary
  • DECOUPLED CONDUCTION/CONVECTION DUAL HEAT SINK FOR ON-BOARD MEMORY MICROCONTROLLERS
    Publication number: 20200383232
    Abstract: A heat sink may include a base having a first surface in a first plane configured to contact a system on chip (SoC) located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending from the base. The plurality of heat transfer members are configured to extend along a longitudinal length in a second plane having a first spacing from the first plane. The plurality of heat transfer members respectively include opposing internal walls that define a second spacing between the plurality of heat transfer members. The heat sink may include an enclosure surrounding the plurality of heat transfer members. The enclosure may include a base plate that contacts the base of the heat sink to form a cold-plate. The enclosure may partially surround the length of the heat transfer members, allowing airflow through the enclosure in a cross direction.
    Type: Application
    Filed: July 12, 2019
    Publication date: December 3, 2020
    Inventor: Brandon GARY