Patents by Inventor Brandon K. W. Mui

Brandon K. W. Mui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-profile stacked patch radiator with integrated heating circuit
    Patent number: 10741901
    Abstract: An apparatus includes a stacked patch radiator having (i) a lower patch and (ii) an upper patch located above and separated from the lower patch. The upper patch includes first and second conductive patches that are separated from one another. The apparatus also includes a heating circuit integrated in the stacked patch radiator. At least a portion of the heating circuit is positioned between the first and second conductive patches of the upper patch. The stacked patch radiator can be configured to radiate at a specified frequency band and can have a thickness that is less than one tenth of wavelengths within the specified frequency band. The upper patch can include conductive vias electrically connecting the conductive patches. The conductive patches and the conductive vias can form an isolation cage configured to reduce a signal loss associated with a presence of at least the portion of the heating circuit between the conductive patches.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: August 11, 2020
    Assignee: Raytheon Company
    Inventors: Yueh-Chi Chang, Brandon K.W. Mui, Stephen J. Pereira, Richard S. Young, Gregory M. Fagerlund, Wayne B. Mattis
  • LOW-PROFILE STACKED PATCH RADIATOR WITH INTEGRATED HEATING CIRCUIT
    Publication number: 20190115645
    Abstract: An apparatus includes a stacked patch radiator having (i) a lower patch and (ii) an upper patch located above and separated from the lower patch. The upper patch includes first and second conductive patches that are separated from one another. The apparatus also includes a heating circuit integrated in the stacked patch radiator. At least a portion of the heating circuit is positioned between the first and second conductive patches of the upper patch. The stacked patch radiator can be configured to radiate at a specified frequency band and can have a thickness that is less than one tenth of wavelengths within the specified frequency band. The upper patch can include conductive vias electrically connecting the conductive patches. The conductive patches and the conductive vias can form an isolation cage configured to reduce a signal loss associated with a presence of at least the portion of the heating circuit between the conductive patches.
    Type: Application
    Filed: October 17, 2017
    Publication date: April 18, 2019
    Inventors: Yueh-Chi Chang, Brandon K. W. Mui, Stephen J. Pereira, Richard S. Young, Gregory M. Fagerlund, Wayne B. Mattis