Abstract: An enclosure for convection cooling an electronic module in a motor vehicle includes a cold plate for mounting the electronic module thereon. A cover is attached to the bottom plate, and the cover and the bottom plate define a cavity. A plurality of inlets are formed in the cover in fluid communication with the cavity. A plurality of outlets are formed in the cover in fluid communication with the cavity, the outlets spaced apart from and opposite the inlets. An inlet manifold is disposed in fluid communication with the plurality of inlets, and a plurality of fans is disposed in fluid communication with the cavity, each of the plurality of fans having an inlet side in fluid communication with an outlet side.