Abstract: Carrying cases, particularly backpacks, having a J-shaped zipper disposed on a side aspect thereof, as well as methods of manufacture and use thereof, are provided. The carrying cases are constructed of front, back, and side panels, which are preferably made of a durable, lightweight, puncture-resistant material. The J-shaped zipper disposed on the side aspect of the backpack allows a user of the backpack to access a primary storage compartment of the backpack, and particularly to insert larger items into the backpack or remove larger items therefrom, via a side panel of the backpack. Among other advantages, the J-shaped side-access zipper allows the user to access an interior volume of the backpack during wear, i.e. without removing the backpack.

Abstract: Collapsible or otherwise selectively reconfigurable carrying cases, and methods for the manufacture and use thereof, are provided. The carrying cases are constructed of at least two body panels made of puncture-resistant material and are selectively reconfigurable between an expanded configuration and a collapsed configuration by the use of a zipper disposed around all or substantially all of a perimeter or circumference of the at least two body panels. The carrying cases are adapted to receive and securely store and carry fragile items, e.g. cameras and photographic equipment, when in the expanded configuration and to collapse or otherwise significantly reduce in volume when in the collapsed configuration for easy storage and transportation.

Abstract: A BGA package is disclosed including a base IC structure having a base substrate, with an opening running length-wise there through. A first semiconductor chip is mounted face-down on the base substrate so the bond pads thereof are accessible through the opening. The package also includes a secondary IC structure including a secondary substrate, having an opening running there through, and a second semiconductor chip. The second chip is mounted face-down on the secondary substrate so that the bond pads thereof are accessible through the opening in the secondary substrate. An encapsulant fills the opening in the secondary substrate and forms a substantially planar surface over the underside of the secondary substrate. The substantially planar surface is mounted to the first chip of the base IC structure through an adhesive. Wires connect a conductive portion of the secondary IC structure to a conductive portion of the base IC structure.

Abstract: A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.

Abstract: A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.