Patents by Inventor Brandon Leong
Brandon Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10856100Abstract: A mobile device may identify nearby locations, such as locations of a merchant. The mobile device may create local geofences around the nearby locations. The mobile device may create an exit geofence which includes all of the local geofences. In response to the mobile device entering one of the local geofences, the mobile device may provide a notification regarding the location. In response to the mobile device leaving the exit geofence, the mobile device may identify nearby locations based on the new location of the mobile device, and the mobile device may create new local geofences for the current nearby locations, as well as a new exit geofence.Type: GrantFiled: July 3, 2018Date of Patent: December 1, 2020Assignee: AMERICAN EXPRESS TRAVEL RELATED SERVICES COMPANY, INC.Inventors: John L. Ahn, Ashish Bhaskar, Vasanth Dharmaraj, Jacob Duron, James H. Graves, Stewart M. Kendall, Brandon Leong, Elmahdi Nahro, Jimit Baldev Patel, Nishtha Patel, Ashish A. Pawale, Pradeep Peethambaram, Jose Villegas, James Ware
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Publication number: 20200015034Abstract: A mobile device may identify nearby locations, such as locations of a merchant. The mobile device may create local geofences around the nearby locations. The mobile device may create an exit geofence which includes all of the local geofences. In response to the mobile device entering one of the local geofences, the mobile device may provide a notification regarding the location. In response to the mobile device leaving the exit geofence, the mobile device may identify nearby locations based on the new location of the mobile device, and the mobile device may create new local geofences for the current nearby locations, as well as a new exit geofence.Type: ApplicationFiled: July 3, 2018Publication date: January 9, 2020Applicant: American Express Travel Related Services Company, Inc.Inventors: JOHN L. AHN, ASHISH BHASKAR, VASANTH DHARMARAJ, JACOB DURON, JAMES H. GRAVES, STEWART M. KENDALL, BRANDON LEONG, ELMAHDI NAHRO, JIMIT BALDEV PATEL, NISHTHA PATEL, ASHISH A. PAWALE, PRADEEP PEETHAMBARAM, JOSE VILLEGAS, JAMES WARE
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Patent number: 9297571Abstract: A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes multiple heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes one or more swivel joints, each configured to provide one or more fluid paths between the cooling door and the frame. The cooling door assembly includes separate and independent fluid paths, where fluid is separately provided to each independent fluid path. Different groups of heat exchangers are coupled to each independent fluid path. In the event of failure of one of the independent fluid paths, the other independent fluid path(s) remain operational.Type: GrantFiled: July 2, 2012Date of Patent: March 29, 2016Assignee: Liebert CorporationInventors: Adrian Correa, Tien-Chieh (Eric) Lin, James Hom, Gregory Shiomoto, Norman Chow, Brandon Leong, Richard Grant Brewer, Douglas E. Werner, Mark McMaster
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Patent number: 8250877Abstract: A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.Type: GrantFiled: November 14, 2008Date of Patent: August 28, 2012Assignee: Cooligy Inc.Inventors: Adrian Correa, Tien Chih (Eric) Lin, James Hom, Gregory Shiomoto, Norman Chow, Brandon Leong, Richard Grant Brewer, Douglas E. Werner, Mark McMaster
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Patent number: 8254422Abstract: A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.Type: GrantFiled: August 5, 2009Date of Patent: August 28, 2012Assignee: Cooligy Inc.Inventors: Madhav Datta, Brandon Leong, Mark McMaster
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Publication number: 20110073292Abstract: The present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a small pressure drop across the system. The present invention teaches the use of wall features on the fins of a heat exchanger to cool fluid in a fluid cooling system. The present invention also discloses high aspect ratio, high surface area structures applicable in micro-heat exchangers for fluid cooling systems and cost effective methods for manufacturing the same.Type: ApplicationFiled: September 30, 2009Publication date: March 31, 2011Inventors: Madhav Datta, Peng Zhou, Hae-won Choi, Brandon Leong, Mark McMaster, Douglas E. Werner
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Patent number: 7746634Abstract: The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects.Type: GrantFiled: August 7, 2008Date of Patent: June 29, 2010Assignee: Cooligy Inc.Inventors: James Hom, Hae-won Choi, Tien Chih (Eric) Lin, Douglas E. Werner, Norman Chow, Adrian Correa, Brandon Leong, Sudhakar Gopalakrishnan, Richard Grant Brewer, Mark McMaster, Girish Upadhya
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Publication number: 20100032143Abstract: A microheat exchanging assembly is configured to cool one or more heat generating devices, such as integrated circuits or laser diodes. The microheat exchanging assembly includes a first ceramic assembly thermally coupled to a first surface, and in cases, a second ceramic assembly thermally coupled to a second surface. The ceramic assembly includes one or more electrically and thermally conductive pads to be thermally coupled to a heat generating device, each conductive pad is electrically isolated from each other. The ceramic assembly includes a ceramic layer to provide this electrical isolation. A top surface and a bottom surface of the ceramic layer are each bonded to a conductive layer, such as copper, using an intermediate joining material. A brazing process is performed to bond the ceramic layer to the conductive layer via a joining layer. The joining layer is a composite of the joining material, the ceramic layer, and the conductive layer.Type: ApplicationFiled: August 5, 2009Publication date: February 11, 2010Applicant: Cooligy Inc.Inventors: Madhav Datta, Brandon Leong, Mark McMaster
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Publication number: 20090225513Abstract: A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.Type: ApplicationFiled: November 14, 2008Publication date: September 10, 2009Inventors: Adrian Correa, Tien Chih (Eric) Lin, James Hom, Gregory Shiomoto, Norman Chow, Brandon Leong, Richard Grant Brewer, Douglas E. Werner, Mark McMaster
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Publication number: 20090225514Abstract: A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.Type: ApplicationFiled: November 14, 2008Publication date: September 10, 2009Inventors: Adrian Correa, Tien Chih (Eric) Lin, James Hom, Gregory Shiomoto, Norman Chow, Brandon Leong, Richard Grant Brewer, Douglas E. Werner, Mark McMaster
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Publication number: 20090046423Abstract: The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects.Type: ApplicationFiled: August 7, 2008Publication date: February 19, 2009Inventors: James Hom, Hae-won Choi, Tien Chih (Eric) Lin, Douglas E. Werner, Norman Chow, Adrian Correa, Brandon Leong, Sudhakar Gopalakrishnan, Richard Grant Brewer, Mark McMaster, Girish Upadhya