Patents by Inventor Brandon Michael Potens

Brandon Michael Potens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10019029
    Abstract: A housing for an electronic device includes a single rear housing assembly coupled to the cover glass of a display assembly. The rear housing assembly includes a metal rear chassis with two layers of injection molded material formed on at least the chassis side regions. The first injection molded layer includes a high reinforcing agent content percentage to provide increased stiffness, and the second injection molded layer includes a low reinforcing agent content percentage, which provides less structural support than the first injection molded layer, but an improved aesthetic appearance.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: July 10, 2018
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Michael Xingyi Yu, Brandon Michael Potens, Kelly Erin Johnson, Mark Novak, Ge PengJin, Robert Cong Liang, Angel Wilfredo Martinez, Srivatsan Subbarayan, Mandar Nilkanth Kulkarni, Marc Anthony Zampino, Felipe Alonso Varela, Michael Christopher Kouxommone
  • Patent number: 9258921
    Abstract: This disclosure relates to systems and methods for securing a port component of a user that receives a connection component to a remote device. The port component may be secured by a docking component that may include compressible features that apply a force to the port component to insure proper alignment or orientation to receive the connection component.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: February 9, 2016
    Assignee: Amazon Technologies, Inc.
    Inventors: Brandon Michael Potens, Joshua Paul Davies, Andrew McIntyre, Angel Wilfredo Martinez
  • Patent number: 9218020
    Abstract: A computing device is assembled to withstand drops, to be re-workable, and to reduce unaesthetic variances between the components. A computing device has a display module that is removably hinged on the bottom, held in place by snap fits on the top before being screwed in place, and held in place by replaceable snap fits on the sides. A battery module and a battery connector can be secured in place with stretch removable tape. A peripheral port component may be biased towards an interior of the housing opening when installed. A laser direct structuring antenna module located in a recess of a plastic molding can be grounded to a metal alloy housing. A plastic molding can be mechanically interlocked to a housing.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: December 22, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: Angel Wilfredo Martinez, Michael Xingyi Yu, Joshua Paul Davies, Brandon Michael Potens, Andrew McIntyre, Joshua Danel Lemons, Kelly Erin Johnson
  • Patent number: 9153902
    Abstract: Certain embodiments herein relate to mounting configurations for transferring forces or loads away from connectors for a device. A mounting element may be secured to a connector and, in response to the connector receiving a certain amount of force, may move the connector to a surface or an element associated with the device that may be more suitable for withstanding the force. Various positions of a mounting element with respect to a connector, and/or geometric variations of the mounting element, may allow the mounting element to move the connector in multiple planes, such as vertical, horizontal, and/or diagonal.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 6, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: Joshua Paul Davies, Angel Wilfredo Martinez, Andrew McIntyre, Brandon Michael Potens
  • Patent number: 9088112
    Abstract: According to one or more embodiments of the disclosure, a device is provided. The printed circuit board may include an electronic receptacle. Additionally, the printed circuit board may include a housing element housing a portion of the electronic receptacle. As such, the housing element may include a top portion, a bottom portion, and at least one side portion. To this end, the top portion of the housing element may extend above a bottom surface of the printed circuit board, and the bottom portion of the housing element may extend below the bottom surface of the printed circuit board. Moreover, the printed circuit board may include at least one spring connector coupled to the electronic receptacle and the printed circuit board.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: July 21, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: Joshua Paul Davies, Brandon Michael Potens, Andrew McIntyre, Angel Wilfredo Martinez, Kelly Erin Johnson