Patents by Inventor Brandon N. SORBOM
Brandon N. SORBOM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240387063Abstract: Techniques are described for automatically removing and replacing components, including a vacuum vessel, from a tokamak. The inventors have recognized that schemes for automatically removing and replacing components from a tokamak should preferably be simple (e.g., using proven equipment to perform a series of non-mechanically complex tasks) and have a very low risk of damaging components. Techniques described herein may include splitting a tokamak into multiple pieces, separating the pieces, and removing the now separate pieces of the vacuum vessel from within the pieces of the tokamak. A new vacuum vessel can be inserted in multiple pieces and the tokamak rejoined to complete the replacement process.Type: ApplicationFiled: May 16, 2023Publication date: November 21, 2024Applicant: Commonwealth Fusion Systems LLCInventors: Brandon N. Sorbom, Robert Mumgaard, Daniel Brunner, Alexander Creely, Cody Dennett, Matthew Vernacchia, Caroline Sorensen, Theodore Wyeth
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Publication number: 20240203628Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: September 28, 2023Publication date: June 20, 2024Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Shunichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Publication number: 20230361549Abstract: Described are cable joints and related structures and techniques for coupling high temperature superconducting (HTS) cables. A cable joint includes a conductive member having a length which defines the length of the joint and having first and second mounting regions shaped to accept first and second HTS cable with an interface layer comprised of a malleable metal disposed between a surfaces of the first and second mounting regions and surfaces of the first and second HTS cables.Type: ApplicationFiled: December 2, 2020Publication date: November 9, 2023Applicants: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Zachary HARTWIG, Philip MICHAEL, Brandon N. SORBOM, James IRBY, Rui VIEIRA, William BECK, Erica SALAZAR, Vincent FRY
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Patent number: 11810712Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 30, 2022Date of Patent: November 7, 2023Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Shunichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20220336130Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: June 30, 2022Publication date: October 20, 2022Applicants: Massachusetts Institute of Technology, Commonwealth Fusion System LLCInventors: Brian LABOMBARD, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Patent number: 11417464Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: June 11, 2021Date of Patent: August 16, 2022Assignees: Massachusetts Institute of Technology, Commonwealth Fusion Systems LLCInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20210313104Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: June 11, 2021Publication date: October 7, 2021Inventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Patent number: 11094439Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: GrantFiled: December 23, 2019Date of Patent: August 17, 2021Assignee: Massachusetts Institute of TechnologyInventors: Brian Labombard, Robert S. Granetz, James Irby, Rui Vieira, William Beck, Daniel Brunner, Jeffrey Doody, Martin Greenwald, Zachary Hartwig, Philip Michael, Robert Mumgaard, Alexey Radovinsky, Syun'ichi Shiraiwa, Brandon N. Sorbom, John Wright, Lihua Zhou
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Publication number: 20200402693Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: December 23, 2019Publication date: December 24, 2020Inventors: Alexey RADOVINSKY, Brian LABOMBARD, Daniel BRUNNER, Robert S. GRANETZ, James IRBY, Rui VIEIRA, William BECK, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU
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Publication number: 20200211744Abstract: Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.Type: ApplicationFiled: December 27, 2018Publication date: July 2, 2020Inventors: Brian LABOMBARD, Robert GRANETZ, James IRBY, Rui VIEIRA, William BECK, Daniel BRUNNER, Jeffrey DOODY, Martin GREENWALD, Zachary HARTWIG, Philip MICHAEL, Robert MUMGAARD, Alexey RADOVINSKY, Syun'ichi SHIRAIWA, Brandon N. SORBOM, John WRIGHT, Lihua ZHOU