Patents by Inventor Brandon Paul Linford
Brandon Paul Linford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230017882Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving performance and/or leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween. Other embodiments are directed to methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.Type: ApplicationFiled: July 20, 2022Publication date: January 19, 2023Inventors: Brandon Paul Linford, Cody William Knuteson, Jason Dean Blackburn, Daniel Call Mortensen, Steven Swan
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Patent number: 11421485Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving performance and/or leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween. The plurality of diamond grains includes a first amount being about 5 weight % to about 65 weight % of the plurality of diamond grains and a second amount being about 18 weight % to about 95 weight % of the plurality of diamond grains. The first amount exhibits a first average grain size of about 0.5 ?m to about 30 ?m. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 10 ?m to about 65 ?m. Other embodiments are directed to methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.Type: GrantFiled: December 9, 2019Date of Patent: August 23, 2022Assignee: US Synthetic CorporationInventors: Brandon Paul Linford, Cody William Knuteson, Jason Dean Blackburn, Daniel Call Mortensen, Steven Swan
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Patent number: 11235435Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount being about 30 to about 65 volume % of the diamond grains and a second amount being about 18 to about 65 volume % of the diamond grains. The first amount exhibits a first average grain size of about 8 ?m to about 22 ?m. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 15 ?m to about 50 ?m. Other embodiments are directed methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.Type: GrantFiled: September 10, 2019Date of Patent: February 1, 2022Assignee: US SYNTHETIC CORPORATIONInventors: Brandon Paul Linford, Cody William Knuteson
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Patent number: 10501998Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving performance and/or leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes a plurality of diamond grains exhibiting diamond-to-diamond bonding therebetween. The plurality of diamond grains includes a first amount being about 5 weight % to about 65 weight % of the plurality of diamond grains and a second amount being about 18 weight % to about 95 weight % of the plurality of diamond grains. The first amount exhibits a first average grain size of about 0.5 ?m to about 30 ?m. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 10 ?m to about 65 ?m. Other embodiments are directed to methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.Type: GrantFiled: February 20, 2015Date of Patent: December 10, 2019Assignee: US SYNTHETIC CORPORATIONInventors: Brandon Paul Linford, Cody William Knuteson, Jason Dean Blackburn, Daniel Call Mortensen, Steven Swan
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Patent number: 10449658Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount being about 30 to about 65 volume % of the diamond grains and a second amount being about 18 to about 65 volume % of the diamond grains. The first amount exhibits a first average grain size of about 8 ?m to about 22 ?m. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 15 ?m to about 50 ?m. Other embodiments are directed methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.Type: GrantFiled: April 21, 2016Date of Patent: October 22, 2019Assignee: US SYNTHETIC CORPORATIONInventors: Brandon Paul Linford, Cody William Knuteson
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Patent number: 10280687Abstract: Embodiments relate to polycrystalline diamond compacts and methods of manufacturing such compacts in which an at least partially leached polycrystalline diamond (“PCD”) table is infiltrated with first and second infiltrants. The first infiltrant includes a low viscosity cobalt-based and/or nickel-based alloy infiltrant. The second infiltrant (e.g., copper) is specifically selected to be more easily infiltrated and/or removed (e.g., leached) than a pure cobalt infiltrant. In an embodiment, a method includes forming a PCD table in the presence of a metal-solvent catalyst in a first high-pressure/high-temperature (“HPHT”) process. The PCD table may be at least partially leached to remove at least a portion of the metal-solvent catalyst therefrom. The leached PCD table and a substrate are subjected to a second HPHT process effective to bond the substrate to the leached PCD table while at least partially infiltrating the PCD table with at least the first and second infiltrants.Type: GrantFiled: June 24, 2014Date of Patent: May 7, 2019Assignee: US SYNTHETIC CORPORATIONInventors: Debkumar Mukhopadhyay, Brandon Paul Linford, Jed Clarke
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Patent number: 9938776Abstract: Embodiments of the invention relate to polycrystalline diamond compacts including a substrate having a convexly-curved interfacial surface bonded to a polycrystalline diamond table. In an embodiment, a polycrystalline diamond compact includes a substrate including at least one side surface and a convexly-curved interfacial surface that may, in some embodiments, extend inwardly directly from the at least one side surface to form at least one peripheral edge therebetween. The polycrystalline diamond compact further includes a polycrystalline diamond table bonded to the convexly-curved interfacial surface of the substrate.Type: GrantFiled: February 22, 2016Date of Patent: April 10, 2018Assignee: US SYNTHETIC CORPORATIONInventors: Alberto Castillo, Jedediah Chad Clarke, Brandon Paul Linford
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Patent number: 9346149Abstract: Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount being about 30 to about 65 volume % of the diamond grains and a second amount being about 18 to about 65 volume % of the diamond grains. The first amount exhibits a first average grain size of about 8 ?m to about 22 ?m. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 15 ?m to about 50 ?m. Other embodiments are directed methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.Type: GrantFiled: January 4, 2013Date of Patent: May 24, 2016Assignee: US SYNTHETIC CORPORATIONInventors: Brandon Paul Linford, Cody William Knuteson
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Patent number: 9297212Abstract: Embodiments of the invention relate to polycrystalline diamond compacts including a substrate having a convexly-curved interfacial surface bonded to a polycrystalline diamond table. In an embodiment, a polycrystalline diamond compact includes a substrate including at least one side surface and a convexly-curved interfacial surface that may, in some embodiments, extend inwardly directly from the at least one side surface to form at least one peripheral edge therebetween. The polycrystalline diamond compact further includes a polycrystalline diamond table bonded to the convexly-curved interfacial surface of the substrate.Type: GrantFiled: April 16, 2013Date of Patent: March 29, 2016Assignee: US SYNTHETIC CORPORATIONInventors: Alberto Castillo, Jedediah Chad Clarke, Brandon Paul Linford
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Patent number: 8875814Abstract: The disclosure provides a super abrasive element containing a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores and a contact surface, a base adjacent the contact surface of the TSP body; and an infiltrant material infiltrated in the base and in the pores of the TSP body at the contact surface. The disclosure additionally provides earth-boring drill bits and other devices containing such super abrasive elements. The disclosure further provides methods and mold assemblies for forming such super abrasive elements via infiltration and hot press methods.Type: GrantFiled: April 26, 2012Date of Patent: November 4, 2014Assignee: Halliburton Energy Services, Inc.Inventors: Brian Atkins, Seth G. Anderle, Robert W. Arfele, Ram L. Ladi, Brandon Paul Linford, Jason Keith Wiggins, Kevin Duy Nguyen, Jiang Qian, Kenneth Eugene Bertagnolli, Shawn Casey Scott, Debkumar Mukhopadhyay, Michael Alexander Vail
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Patent number: 8764862Abstract: The disclosure provides a super abrasive element containing a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores and a contact surface, a base adjacent the contact surface of the TSP body; and an infiltrant material infiltrated in the base and in the pores of the TSP body at the contact surface. The disclosure additionally provides earth-boring drill bits and other devices containing such super abrasive elements. The disclosure further provides methods and mold assemblies for forming such super abrasive elements via infiltration and hot press methods.Type: GrantFiled: April 26, 2012Date of Patent: July 1, 2014Assignee: Halliburton Energy Services, Inc.Inventors: Brian Atkins, Seth G. Anderle, Robert W. Arfele, Ram L. Ladi, Brandon Paul Linford, Jason Keith Wiggins, Kevin Duy Nguyen, Jiang Qian, Kenneth Eugene Bertagnolli, Shawn Casey Scott, Debkumar Mukhopadhyay, Michael Alexander Vail
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Publication number: 20130056284Abstract: The disclosure provides a super abrasive element containing a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores and a contact surface, a base adjacent the contact surface of the TSP body; and an infiltrant material infiltrated in the base and in the pores of the TSP body at the contact surface. The disclosure additionally provides earth-boring drill bits and other devices containing such super abrasive elements. The disclosure further provides methods and mold assemblies for forming such super abrasive elements via infiltration and hot press methods.Type: ApplicationFiled: April 26, 2012Publication date: March 7, 2013Inventors: Brian Atkins, Seth G. Anderle, Robert W. Arfele, Ram L. Ladi, Brandon Paul Linford, Jason Keith Wiggins, Kevin Duy Nguyen, Jiang Qian, Kenneth Eugene Bertagnolli, Shawn Casey Scott, Debkumar Mukhopadhyay, Michael Alexander Vail
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Publication number: 20130055645Abstract: The disclosure provides a super abrasive element containing a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores and a contact surface, a base adjacent the contact surface of the TSP body; and an infiltrant material infiltrated in the base and in the pores of the TSP body at the contact surface. The disclosure additionally provides earth-boring drill bits and other devices containing such super abrasive elements. The disclosure further provides methods and mold assemblies for forming such super abrasive elements via infiltration and hot press methods.Type: ApplicationFiled: April 26, 2012Publication date: March 7, 2013Inventors: Brian Atkins, Seth G. Anderle, Robert W. Arfele, Ram L. Ladi, Brandon Paul Linford, Jason Keith Wiggins, Kevin Duy Nguyen, Jiang Qian, Kenneth Eugene Bertagnolli, Shawn Casey Scott, Debkumar Mukhopadhyay, Michael Alexander Vail
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Patent number: 8261858Abstract: The disclosure provides a super abrasive element containing a substantially catalyst-free thermally stable polycrystalline diamond (TSP) body having pores and a contact surface, a base adjacent the contact surface of the TSP body; and an infiltrant material infiltrated in the base and in the pores of the TSP body at the contact surface. The disclosure additionally provides earth-boring drill bits and other devices containing such super abrasive elements. The disclosure further provides methods and mold assemblies for forming such super abrasive elements via infiltration and hot press methods.Type: GrantFiled: September 2, 2011Date of Patent: September 11, 2012Assignee: Halliburton Energy Services, Inc.Inventors: Brian Atkins, Seth G. Anderle, Robert W. Arfele, Ram L. Ladi, Brandon Paul Linford, Jason Keith Wiggins, Kevin Duy Nguyen, Jiang Qian, Kenneth Eugene Bertagnolli, Shawn Casey Scott, Debkumar Mukhopadhyay, Michael Alexander Vail