Abstract: An end effector includes a body, a first tine, and a second tine. The body includes first, second, and third substrate support pads, the first substrate support pad defines a first height, the second substrate support pad defines a second height less than the first height, and the third substrate support pad defines a third height equal to the first height. The first tine includes fourth and fifth substrate support pads, the fourth substrate support pad defines a fourth height equal to the second height, and the fifth substrate support pad defines a fifth height equal to the first and third heights. The second tine includes sixth and seventh substrate support pads, the sixth substrate support pad defines a sixth height equal to the first, third, and fifth heights, the seventh substrate support pad defines a seventh height equal to the second and fourth heights.

Abstract: A wafer alignment system includes an image capture module that captures an image of a wafer positioned on a robot. An image analysis module analyzes the image to determine a position of the wafer on the robot. A position correction module calculates adjustment data based on the determined position of the wafer on the robot. A system control module controls the robot to at least one of place the wafer and retrieve the wafer based on the calculated adjustment data and a nominal position of the wafer on the robot.

Abstract: An end effector includes a body, a first tine, and a second tine. The body includes first, second, and third substrate support pads, the first substrate support pad defines a first height, the second substrate support pad defines a second height less than the first height, and the third substrate support pad defines a third height equal to the first height. The first tine includes fourth and fifth substrate support pads, the fourth substrate support pad defines a fourth height equal to the second height, and the fifth substrate support pad defines a fifth height equal to the first and third heights. The second tine includes sixth and seventh substrate support pads, the sixth substrate support pad defines a sixth height equal to the first, third, and fifth heights, the seventh substrate support pad defines a seventh height equal to the second and fourth heights.

Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.

Abstract: An end effector includes first, second, third, fourth, fifth, sixth, and seventh substrate support pads. A method of handling a substrate with the end effector in a substrate processing system includes engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads. The method also includes moving the end effector a first distance into a processing chamber of the substrate processing system. The method further includes disengaging the peripheral edge of the substrate from the second, fifth, and sixth substrate support pads. The method additionally includes moving the end effector a second distance into the processing chamber of the substrate processing system, and engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads.

Abstract: A substrate cassette loading system for docking substrate cassettes to a substrate processing system is provided. A plurality of ports passes substrates into the substrate processing system, wherein a first port of the plurality of ports is vertically above a second port of the plurality of ports. A plurality of cassette loaders provides substrate cassettes to the plurality of ports.

Abstract: A substrate cassette loading system for docking substrate cassettes to a substrate processing system is provided. A plurality of ports passes substrates into the substrate processing system, wherein a first port of the plurality of ports is vertically above a second port of the plurality of ports. A plurality of cassette loaders provides substrate cassettes to the plurality of ports.

Abstract: Systems and techniques for forming buffer gas microclimates around semiconductor wafers in environments external to a semiconductor processing chamber are disclosed. Such systems may include slot doors that may allow for single wafers to be removed from a multi-wafer stack while limiting outflow of buffer gas from a multi-wafer storage system, as well as buffer gas distributors that move in tandem with robot arms used to transport wafers for at least some of the movements of such robot arms.

Abstract: A wafer alignment system includes an image capture module that captures an image of a wafer positioned on a robot. An image analysis module analyzes the image to determine a position of the wafer on the robot. A position correction module calculates adjustment data based on the determined position of the wafer on the robot. A system control module controls the robot to at least one of place the wafer and retrieve the wafer based on the calculated adjustment data and a nominal position of the wafer on the robot.

Abstract: A wafer alignment system includes an image capture device that captures an image of a wafer positioned on a pedestal. An image analysis module analyzes the image to detect an edge of the wafer and a notch formed in the edge of the wafer and calculates, based on a position of the notch, first and second edge positions corresponding to the edge of the wafer. An offset calculation module that calculates an angular offset of the wafer based on the first position and the second edge positions. A system control module controls transfer of the wafer from the pedestal to a process cell based on the angular offset.

Abstract: An end effector of a wafer transfer system includes synchronously movable blades operable to hold and release wafers. The end effector comprises an end effector housing including a first blade mount coupled to a first blade, a second blade mount coupled to a second blade, and an actuator operable to move the blade mounts on respective linear rails. The actuator includes a longitudinally movable piston coupled to the respective blade mounts by respective actuator links. The actuator links are pivotally coupled to the longitudinally movable piston at respective first ends thereof and to the first and second blade mounts at respective second ends thereof wherein moving the piston towards a retracted position causes the blades to synchronously move laterally towards each other and moving the piston towards the retracted position causes the blades to synchronously move laterally away from each other so as to hold or release a wafer.

Abstract: An end effector includes first, second, third, fourth, fifth, sixth, and seventh substrate support pads. A method of handling a substrate with the end effector in a substrate processing system includes engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads. The method also includes moving the end effector a first distance into a processing chamber of the substrate processing system. The method further includes disengaging the peripheral edge of the substrate from the second, fifth, and sixth substrate support pads. The method additionally includes moving the end effector a second distance into the processing chamber of the substrate processing system, and engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads.

Abstract: An end effector of a wafer transfer system includes synchronously movable blades operable to hold and release wafers. The end effector comprises an end effector housing including a first blade mount coupled to a first blade, a second blade mount coupled to a second blade, and an actuator operable to move the blade mounts on respective linear rails. The actuator includes a longitudinally movable piston coupled to the respective blade mounts by respective actuator links. The actuator links are pivotally coupled to the longitudinally movable piston at respective first ends thereof and to the first and second blade mounts at respective second ends thereof wherein moving the piston towards a retracted position causes the blades to synchronously move laterally towards each other and moving the piston towards the retracted position causes the blades to synchronously move laterally away from each other so as to hold or release a wafer.