Patents by Inventor Branimir Tasic

Branimir Tasic has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TECHNIQUES UTILIZING THERMAL, EMI AND FIPS FRIENDLY ELECTRONIC MODULES
    Publication number: 20100020486
    Abstract: An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.
    Type: Application
    Filed: July 23, 2008
    Publication date: January 28, 2010
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Susheela N. Narasimhan, Hang Tran, Branimir Tasic, John Borg, Wingo Cheong, Nguyen Nguyen
  • Techniques utilizing thermal, EMI and FIPS friendly electronic modules
    Patent number: 7643290
    Abstract: An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.
    Type: Grant
    Filed: July 23, 2008
    Date of Patent: January 5, 2010
    Assignee: Cisco Technology, Inc.
    Inventors: Susheela N. Narasimhan, Hang Tran, Branimir Tasic, John Borg, Wingo Cheong, Nguyen Nguyen