Patents by Inventor Brenda Dingle
Brenda Dingle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Monolithic integration and enhanced light extraction in gallium nitride-based light-emitting devices
Publication number: 20050179042Abstract: An integrated light-emitting device includes multiple p-n diodes integrated monolithically on an insulating substrate. The p-n diodes are of monolithic semiconductor materials over the single substrate. The p-n diodes can be all light-emitting diodes or a combination of light-emitting and ESD-protection diodes. The p-n diodes may have at least one beveled sidewall to enhance light extraction out of the light-emitting diodes. A method for producing such integrated light-emitting device and a method for producing such p-n diode that includes at least one beveled sidewall are also disclosed.Type: ApplicationFiled: February 14, 2005Publication date: August 18, 2005Applicant: Kopin CorporationInventors: Bo Yang, Tchang-hun Oh, Brenda Dingle, William Roberts, Ilya Libenzon, Hong Choi, John Fan -
Publication number: 20050179046Abstract: An improved p-type electrode for a p-type gallium-nitride based semiconductor material is disclosed that includes at least one layer of indium-tin-oxide. The electrode can include the indium-tin-oxide layer(s) such that at least one of the indium-tin-oxide layers is in contact with the p-type semiconductor layer. Alternatively, the electrode can further include a first electrode layer in contact with the p-type semiconductor layer. In this example, the indium-tin-oxide layer(s) is over the first electrode layer. The first electrode layer includes at least one metal selected from the group consisting of nickel oxide, molybdenum oxide, ruthenium oxide and zinc oxide, and/or at least one non-oxidizing metal.Type: ApplicationFiled: February 14, 2005Publication date: August 18, 2005Applicant: Kopin CorporationInventors: Tchang-hun Oh, Brenda Dingle, Bo Yang, Ilya Libenzon, William Roberts, Hong Choi, John Fan
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Patent number: 6627953Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: June 13, 2000Date of Patent: September 30, 2003Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
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Patent number: 6624046Abstract: A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.Type: GrantFiled: November 1, 1999Date of Patent: September 23, 2003Assignee: Kopin CorporationInventors: Paul M. Zavracky, Matthew Zavracky, Duy-Phach Vu, Brenda Dingle
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Patent number: 6608654Abstract: The present invention relates to methods of fabricating pixel electrodes (44) for active matrix displays including the formation of arrays of transistor circuits in thin film silicon (10) on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate (24). An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.Type: GrantFiled: March 17, 1997Date of Patent: August 19, 2003Assignee: Kopin CorporationInventors: Paul M. Zavracky, Duy-Phach Vu, Brenda Dingle, Matthew Zavracky, Mark B. Spitzer
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Publication number: 20030057425Abstract: A display panel is formed using essentially single crystal thin-film material that is transferred to substrates for display fabrication. The transfer includes the step of transferring the semiconductor regions onto a stretchable substrate. The resulting circuit panel can be incorporated into a display panel with a light emitting or liquid crystal material to provide the desired display.Type: ApplicationFiled: July 1, 2002Publication date: March 27, 2003Applicant: Kopin CorporationInventors: Paul M. Zavracky, John C. C. Fan, Robert McClelland, Jeffrey Jacobsen, Brenda Dingle
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Patent number: 6521940Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: August 30, 2000Date of Patent: February 18, 2003Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
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Publication number: 20030020084Abstract: Light emitting diodes (LEDs) and LED bars and LED arrays formed of semiconductive material such as III-V and particularly AIGaAs/GaAs material are formed in very thin structures using organometallic vapor deposition (OMCVD). Semiconductor p-n junctions are formed as deposited using carbon as the p-type impurity dopant. Various lift-off methods are described which permit back side processing when the growth substrate is removed and also enabled device registration for LED bars and arrays to be maintained.Type: ApplicationFiled: April 29, 2002Publication date: January 30, 2003Applicant: Kopin CorporationInventors: John C. C. Fan, Brenda Dingle, Shambhu Shastry, Mark B. Spitzer, Robert W. McClelland
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Patent number: 6424020Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: December 29, 1997Date of Patent: July 23, 2002Assignee: Kopin CorporationInventors: Duy-Pach Vu, Brenda Dingle, Ngwe Cheong
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Patent number: 6414783Abstract: A display panel is formed using essentially single crystal thin-film material that is transferred to substrates for display fabrication. The transfer includes the step of transferring the semiconductor regions onto a stretchable substrate. The resulting circuit panel can be incorporated into a display panel with a light emitting or liquid crystal material to provide the desired display.Type: GrantFiled: March 20, 2001Date of Patent: July 2, 2002Assignee: Kopin CorporationInventors: Paul M. Zavracky, John C. C. Fan, Robert McClelland, Jeffrey Jacobsen, Brenda Dingle
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Patent number: 6403985Abstract: Light emitting diodes (LEDs) and LED bars and LED arrays formed of semiconductive material, such as III-V, and particularly AlGaAs/CaAs material, are formed in very thin structures using organometallic vapor deposition (OMCVD). Semiconductor p-n junctions are formed as deposited using carbon as the p-type impurity dopant. Various lift-off methods are described which permit back side processing when the growth substrate is removed and also enable device registration for LED bars and arrays to be maintained.Type: GrantFiled: December 23, 1994Date of Patent: June 11, 2002Assignee: Kopin CorporationInventors: John C. C. Fan, Brenda Dingle, Shambhu Shastry, Mark B. Spitzer, Robert W. McClelland
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Publication number: 20020030767Abstract: The present invention relates to methods of fabricating pixel electrodes (44) for active matrix displays including the formation of arrays of transistor circuits in thin film silicon (10) on an insulating substrate and transfer of this active matrix circuit onto an optically transmissive substrate (24). An array of color filter elements can be formed prior to transfer of the active matrix circuit that are aligned between a light source for the display and the array of pixel electrodes to provide a color display.Type: ApplicationFiled: March 17, 1997Publication date: March 14, 2002Inventors: PAUL M. ZAVRACKY, DUY-PHACH VU, BRENDA DINGLE, MATTHEW ZAVRACKY, MARK B. SPITZER
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Patent number: 6317175Abstract: A display panel is formed using a single crystal thin-film transistors that are transferred to substrates for display fabrication. Pixel arrays form light valves or switches that can be fabricated with control electronics in the thin-film material prior to transfer. The resulting circuit panel is then incorporated into a projection display system with a light emitting or liquid crystal material to provide the desired light valve.Type: GrantFiled: June 6, 1995Date of Patent: November 13, 2001Assignee: Kopin CorporationInventors: Jack P. Salerno, Paul M. Zavracky, Mark B. Spitzer, Brenda Dingle
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Publication number: 20010019371Abstract: A display panel is formed using essentially single crystal thin-film material that is transferred to substrates for display fabrication. The transfer includes the step of transferring the semiconductor regions onto a stretchable substrate. The resulting circuit panel can be incorporated into a display panel with a light emitting or liquid crystal material to provide the desired display.Type: ApplicationFiled: March 20, 2001Publication date: September 6, 2001Applicant: Kopin CorporationInventors: Paul M. Zavracky, John C. C. Fan, Robert McClelland, Jeffrey Jacobsen, Brenda Dingle
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Patent number: 6232136Abstract: A display panel is formed using essentially single crystal thin-film material that is transferred to substrates for display fabrication. The transfer includes the step of transferring the semiconductor regions onto a stretchable substrate. The resulting circuit panel can be incorporated into a display panel with a light emitting or liquid crystal material to provide the desired display.Type: GrantFiled: April 6, 1998Date of Patent: May 15, 2001Assignee: Kopin CorporationInventors: Paul M. Zavracky, John C. C. Fan, Robert McClelland, Jeffrey Jacobsen, Brenda Dingle
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Patent number: 6143582Abstract: The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of higher density and complexity than can be obtained by using conventional multi-chip modules. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in a complete glass-based modules. Other applications are contemplated, such as, displays, microprocessor and memory devices, and communication circuits with optical input and output.Type: GrantFiled: February 12, 1999Date of Patent: November 7, 2000Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda Dingle, Ngwe Cheong
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Patent number: 6027958Abstract: Integrated circuits for use in electronic devices requiring high density packaging are fabricated to provide highly flexible and ultra-thin devices having a variety of applications. The flexible circuits have dimensions up to several centimeters in surface area and thicknesses of a few microns. These circuits are fabricated using transfer techniques which include the removal of VLSI circuits from silicon wafers and mounting of the circuits on application specific substrates.Type: GrantFiled: July 11, 1996Date of Patent: February 22, 2000Assignee: Kopin CorporationInventors: Duy-Phach Vu, Brenda Dingle, Ngwe K. Cheong
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Patent number: 5976953Abstract: A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.Type: GrantFiled: December 8, 1997Date of Patent: November 2, 1999Assignee: Kopin CorporationInventors: Paul M. Zavracky, Matthew Zavracky, Duy-Phach Vu, Brenda Dingle
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Patent number: 5793115Abstract: A multi-layered structure is fabricated in which a microprocessor is configured in different layers and interconnected vertically through insulating layers which separate each circuit layer of the structure. Each circuit layer can be fabricated in a separate wafer or thin film material and then transferred onto the layered structure and interconnected.Type: GrantFiled: September 29, 1994Date of Patent: August 11, 1998Assignee: Kopin CorporationInventors: Paul M. Zavracky, Matthew Zavracky, Duy-Phach Vu, Brenda Dingle
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Patent number: 5736768Abstract: A display panel is formed using essentially single crystal thin-film material that is transferred to substrates for display fabrication. Pixel arrays form light valves or switches that can be fabricated with control electronics in the thin-film material prior to transfer. The resulting circuit panel is than incorporated into a display panel with a light emitting or liquid crystal material to provide the desired display.Type: GrantFiled: June 7, 1995Date of Patent: April 7, 1998Inventors: Paul M. Zavracky, John C. C. Fan, Robert McClelland, Jeffrey Jacobsen, Brenda Dingle