Abstract: The present invention involves a composite pallet for a substrate of a printed circuit board for a vector transient reflow process. The composite pallet includes a heat conductive layer for heat sinking means from the substrate and a heat insulative layer adjacent the conductive layer to shield the substrate from heat and to absorb heat from the heat conductive layer. The heat conductive layer has first and second opposite surfaces. The first surface is configured to receive the substrate disposed thereon to diffuse heat from the substrate during the vector transient reflow process. The heat insulative layer is disposed adjacent the second surface.

Abstract: Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.

Abstract: A no-VOC or low-VOC no-clean flux formulation for use in the assembly of electronic circuit boards having a conformal coating. The formulation comprises a solvent, a water-soluble weak organic acid, a halide-free, non-ionic surfactant, and a biocidal co-solvent. The formulation is compatible with the conformal coating, permits no or low VOC emissions into the environment, and eliminates post-soldering cleaning steps.