Abstract: A display that contains a sparse array of light-emitting diodes (LEDs), including a related system and method of fabrication are disclosed. The display includes at least one panel disposed in or on a transparent material to provide a display on one or both sides of the material. Each tile has a transparent flexible substrate, a sparse array of LEDs disposed on the transparent flexible substrate, a rigid substrate adhered to the transparent flexible substrate via an adhesive layer in which the sparse array of LEDs is encapsulated, and a driver disposed on an edge of the tile and configured to drive the LEDs. The LEDs are sparse enough to enable information to be displayed through the transparent material while still enabling a viewer to see through the transparent material.

Abstract: A vehicular display that contains a sparse array of light-emitting diodes (LEDs), system, and method of fabrication are disclosed. The vehicular display includes at least one tile disposed in a vehicle to provide a display of internal and external information. Each tile has a transparent flexible substrate, a sparse array of LEDs disposed on the transparent flexible substrate, a rigid substrate adhered to the transparent flexible substrate via an adhesive layer in which the sparse array of LEDs is encapsulated, and a driver disposed on an edge of the tile and configured to drive the LEDs. The LEDs are sparse enough to enable information to be displayed through a vehicle window while still enabling a viewer to see through the window.

Abstract: A vehicular display that contains a sparse array of light-emitting diodes (LEDs), system, and method of fabrication are disclosed. The vehicular display includes at least one tile disposed in a vehicle to provide a display of internal and external information. Each tile has a transparent flexible substrate, a sparse array of LEDs disposed on the transparent flexible substrate, a rigid substrate adhered to the transparent flexible substrate via an adhesive layer in which the sparse array of LEDs is encapsulated, and a driver disposed on an edge of the tile and configured to drive the LEDs. The LEDs are sparse enough to enable information to be displayed through a vehicle window while still enabling a viewer to see through the window.

Abstract: A display that contains a sparse array of light-emitting diodes (LEDs), system, and method of fabrication are disclosed. The display includes a panel having at least one tile configured to display information. The panel is disposed within or on a transparent material. Each tile includes an array of LEDs, which have a uniform distance therebetween such that light from the array is viewable on opposing sides of the panel while providing visibility through the panel. A darkening layer on at least one side of the panel provides selectable darkening to block the light from exiting the at least one side of the panel.

Abstract: A light source can include a transparent flexible substrate. A sparse array of light-emitting diodes (LEDs) can be disposed on the transparent flexible substrate. A rigid substrate can be adhered to the transparent flexible substrate such that the sparse array of LEDs is located between the rigid substrate and the transparent flexible substrate. The rigid substrate can be adhered to the transparent flexible substrate with an adhesive layer. The sparse array of LEDs can be encapsulated in an adhesive of the adhesive layer. The adhesive can have a refractive index that is between a refractive index of the transparent flexible substrate and a refractive index of the rigid substrate, inclusive. The sparse array of LEDs can have a light-emitting area that is less than or equal to a specified fraction of a surface area of the sparse array, such as 5 percent or 1 percent.

Abstract: A display that contains a sparse array of light-emitting diodes (LEDs), including a related system and method of fabrication are disclosed. The display includes at least one panel disposed in or on a transparent material to provide a display on one or both sides of the material. Each tile has a transparent flexible substrate, a sparse array of LEDs disposed on the transparent flexible substrate, a rigid substrate adhered to the transparent flexible substrate via an adhesive layer in which the sparse array of LEDs is encapsulated, and a driver disposed on an edge of the tile and configured to drive the LEDs. The LEDs are sparse enough to enable information to be displayed through the transparent material while still enabling a viewer to see through the transparent material.

Abstract: A display that contains a sparse array of light-emitting diodes (LEDs), system, and method of fabrication are disclosed. The display includes a panel having at least one tile configured to display information. The panel is disposed within or on a transparent material. Each tile includes an array of LEDs, which have a uniform distance therebetween such that light from the array is viewable on opposing sides of the panel while providing visibility through the panel. A darkening layer on at least one side of the panel provides selectable darkening to block the light from exiting the at least one side of the panel.

Abstract: Display devices comprise an optionally transparent display area that extends to one or more physical boundaries (edges) of the device. The display area may be located on a front surface of the display device, and the physical boundaries of the device to which the display area extends may be formed by physical sides of the device that intersect with the front surface to define part of a perimeter of the front surface. The display area may comprise a microLED array that extends with the display area to edges of the device. Power and/or control electronics for the display device may be located adjacent the display area but away from the edges of the display device to which the display area extends. Two or more such display devices can be arranged (i.e., tiled) with their display areas adjacent, in contact, and facing the same direction to form an extended continuous microLED display area spanning the display areas of the two or more display devices.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution layer is attached to the plurality of pixels and at least one through silicon via containing an electrical conductor is defined to pass through the inorganic substrate and support an electrical coupling with the top redistribution layer.

Abstract: Embodiments of the invention include a light emitting device including a substrate and a semiconductor structure including a light emitting layer. A first reflective layer surrounds the light emitting device. A wavelength converting element is disposed over the light emitting device. A second reflective layer is disposed adjacent a first sidewall of the wavelength converting element.

Abstract: A light-emitting device is disclosed, including: a substrate; a light-emitting diode (LED) formed on a first surface of the substrate, the LED being arranged to emit primary light; a fence disposed on a second surface of the substrate, the fence including a plurality of walls arranged to define a cell; a light-converting structure disposed in the cell, the light-converting structure being arranged to convert at least a portion of the primary light to secondary light having a wavelength that is different from the wavelength of the primary light; and a reflective element formed on one or more outer surfaces of the walls of the fence, such that the reflective element and the light-converting structure are disposed on opposite sides of the walls of the fence.

Abstract: A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having an array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: A structure according to embodiments of the invention includes a light emitting device for emitting light having a first peak wavelength. A wavelength converting layer is disposed in a path of light emitted by the light emitting device. The wavelength converting layer absorbs light emitted by the light emitting device and emits light having a second peak wavelength. The wavelength converting layer includes a mixture of a wavelength converting material, a transparent material, and an adhesive material, wherein the adhesive material is no more than 15% of the weight of the wavelength converting layer.

Abstract: Described herein is a method and system for dual stretching of wafers to create isolated segmented chip scale packages. A wafer having all array of light-emitting diodes (LEDs) is scribed into LED segments, where each LED segment includes a predetermined number of LEDs. The scribed wafer is placed on a stretchable substrate or tape. The tape is stretched and a layer of optically material is placed in the separation gaps. The stretched wafer is scribed on a LED level. The tape is stretched and another layer of optically opaque material is placed in the separation gaps. The same or different optically opaque material can be used for the layers. The two layers of optically opaque material are formed to provide electrical connectivity between the LEDs in each LED segment. In an implementation, each segment or LED is individually addressable.

Abstract: An LED module includes a substrate having a high thermal conductivity and at least one LED die mounted on the substrate. A wavelength conversion material, such as phosphor or quantum dots in a binder, has a very low thermal conductivity and is formed to have a relatively high volume and low concentration over the LED die so that the phosphor or quantum dots conduct little heat from the LED die. A transparent top plate, having a high thermal conductivity, is positioned over the wavelength conversion material, and a hermetic seal is formed between the top plate and the substrate surrounding the wavelength conversion material. The LED die is located in a cavity in either the substrate or the top plate. In this way, the temperature of the wavelength conversion material is kept well below the temperature of the LED die. The sealing is done in a wafer level process.

Abstract: A lighting structure according to embodiments of the invention includes a semiconductor light emitting device and a flat wavelength converting element attached to the semiconductor light emitting device. The flat wavelength converting element includes a wavelength converting layer for absorbing light emitted by the semiconductor light emitting device and emitting light of a different wavelength. The flat wavelength converting element further includes a transparent layer. The wavelength converting layer is formed on the transparent layer.

Abstract: A structure according to embodiments of the invention includes a light emitting device for emitting light having a first peak wavelength. A wavelength converting layer is disposed in a path of light emitted by the light emitting device. The wavelength converting layer absorbs light emitted by the light emitting device and emits light having a second peak wavelength. The wavelength converting layer includes a mixture of a wavelength converting material, a transparent material, and an adhesive material, wherein the adhesive material is no more than 15% of the weight of the wavelength converting layer.