Patents by Inventor Brendan MCGRAIL

Brendan MCGRAIL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230295375
    Abstract: Oligomeric substances which contain one or more (meth)acryloyl functional groups as well as two or more amide functional groups are useful as components of compositions which may be cured using actinic irradiation to provide polymeric articles.
    Type: Application
    Filed: June 30, 2021
    Publication date: September 21, 2023
    Inventors: Brendan McGrail, Jeffrey Klang, William Wolf, Guillaume Monnier, Christophe Duquenne
  • Publication number: 20230220216
    Abstract: Disclosed are photo-curable compositions and processes to produce a 3D high-frequency dielectric material for use as an insulator in a circuit such as, for example, a high-performance RF component such as, for example, an antenna for electromagnetic transmission, a filter, a transmission line, or a high frequency interconnect. The high frequency circuit structures have a very low dielectric loss at operating frequencies (1-60 GHz).
    Type: Application
    Filed: June 17, 2021
    Publication date: July 13, 2023
    Inventors: Neal Pfeiffenberger, Brendan McGrail, Jon Scholte
  • Patent number: 11591493
    Abstract: Heterocyclic-functional resins, such as epoxides, oxetanes, cyclic carbonates, lactides and lactones, are used in radiation-curable formulations along with ethylenically unsaturated materials such as (meth)acrylates to achieve improved mechanical properties and/or lower shrinkage in the cured compositions prepared therefrom as compared to formulations containing the ethylenically unsaturated materials but no heterocyclic-functional resin. Polymerizable, ethylenically unsaturated metal complexes, such as Zn and Ca carboxylates prepared using unsaturated carboxylic acids or anhydrides, may be employed to effect thermal cure of the heterocyclic-functional resin component of such formulations, which are particularly useful in the production of 3D-printed articles and the like.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: February 28, 2023
    Assignee: Arkema France
    Inventors: Brendan McGrail, William Wolf
  • Publication number: 20220259370
    Abstract: (Meth)acrylate-functionalized oligomers having a) an oligomeric backbone comprised of first segments and second segments and b) (meth)acrylate-functionalized end groups are provided. Such oligomers are useful as components of curable compositions. The first segments, second segments and (meth)acrylate-functionalized end groups are linked together by linking moieties derived from a polyisocyanate. The first segments are residues of a first segment precursor containing a plurality of repeating units and a plurality of isocyanate-reactive functional groups and having a number average molecular weight of at least 250 daltons. The second segments are residues of a second segment precursor, different from the first segment precursor, containing a plurality of repeating units and a plurality of isocyanate-reactive functional groups and having a number average molecular weight of at least 250 daltons.
    Type: Application
    Filed: July 16, 2020
    Publication date: August 18, 2022
    Inventors: Jon SCHOLTE, Brendan MCGRAIL
  • Publication number: 20210309850
    Abstract: A sintered article may be formed from a composition containing at least sinterable thermoplastic particles and a curable (meth)acrylate resin component, wherein the sinterable thermoplastic particles are insoluble in the curable (meth)acrylate resin component at 25° C. The curable (meth)acrylate resin component may be cured, thereby forming an intermediate article which may be converted into a sintered article using conditions effective to remove at least a portion of the matrix formed by the cured curable (meth)acrylate resin component and to sinter the thermoplastic particles.
    Type: Application
    Filed: May 29, 2019
    Publication date: October 7, 2021
    Inventors: David LIU, William WOLF, Brendan MCGRAIL