Abstract: Embodiments of the invention generally relate to apparatus and methods to control the addition of moisture to materials for the production of concrete.

Abstract: Probe accessories, and methods for routing signals between a target and a test instrument using the probe accessories, are disclosed. Some of the probe accessories include a flexible circuit and first and second pairs of contacts. Flexible circuit design varies, but one embodiment has first and second regions, a first conductor and a second conductor, and a separation feature. The first conductor extends into the first region while the second conductor extends into both the first and second regions and has a fixed spacing with respect to the first conductor. A separation feature extends between first and second regions and is operable to create two independently maneuverable legs, each leg comprising an end portion of the first and second regions, while maintaining a fixed spacing between the first and second conductors. The first and second pairs of contacts electrically couple the probe accessories between test points and test instruments.

Abstract: A probe for an array of interconnecting leads between a PCA and an IC has one or more contacts extending laterally from or plated upon one or more arms formed of a flexible printed circuit, and connected by traces along the arm(s) to a header that itself affords connection to measurement equipment. The flexible printed circuit is thin enough to loosely slide between the top of the PCA or PCB and the bottom of the IC. The arm or arms is/are narrow enough to slide between the adjacent leads forming the array, while the normally flat contacts will successively interfere with, to engage and electrically contact, consecutive layers of leads as the probe is progressively inserted. An arm is not so stiff that it cannot yield by a slight compressive warping as the contacts encounter leads. Indexing may be ‘by feel’ or by visible indicia along a top surface of the probe or by a reticle device that moves over the top of the IC, which then has a pattern of indicia corresponding to lead location.

Abstract: In one embodiment, a probe for probing test points on a target board includes a printed circuit board, a frame, and a plurality of spring pins. The printed circuit board (PCB) has a first side with a plurality of solder pads thereon, and a plurality of signal routes that are electrically coupled to the solder pads for routing signals to a test instrument. The frame is mechanically coupled to the PCB and has a main body portion with a plurality of holes therein. The holes in the frame are aligned with the plurality of solder pads on the first side of the PCB. The plurality of spring pins are provided for probing the test points on the target board, with each spring pin being i) disposed in one of the holes in the frame, perpendicularly abutting the first side of the PCB, and ii) electrically coupled to one of the solder pads. Other embodiments, including a method of making a probe, are also disclosed.

Abstract: In one embodiment, a probe for probing test points on a target board includes a printed circuit board, a frame, and a plurality of spring pins. The printed circuit board (PCB) has a first side with a plurality of solder pads thereon, and a plurality of signal routes that are electrically coupled to the solder pads for routing signals to a test instrument. The frame is mechanically coupled to the PCB and has a main body portion with a plurality of holes therein. The holes in the frame are aligned with the plurality of solder pads on the first side of the PCB. The plurality of spring pins are provided for probing the test points on the target board, with each spring pin being i) disposed in one of the holes in the frame, perpendicularly abutting the first side of the PCB, and ii) electrically coupled to one of the solder pads. Other embodiments, including a method of making a probe, are also disclosed.

Abstract: A probe apparatus has first and second access ports and a measurement port. The first and second access ports are adapted to be interposed in a test circuit. A voltage amplifier and a voltage splitter are adapted to present the second access port and the measurement port each with a voltage representative of a voltage received by the first access port.

Abstract: A probe for an array of interconnecting leads between a PCA and an IC has one or more contacts extending laterally from or plated upon one or more arms formed of a flexible printed circuit, and connected by traces along the arm(s) to a header that itself affords connection to measurement equipment. The flexible printed circuit is thin enough to loosely slide between the top of the PCA or PCB and the bottom of the IC. The arm or arms is/are narrow enough to slide between the adjacent leads forming the array, while the normally flat contacts will successively interfere with, to engage and electrically contact, consecutive layers of leads as the probe is progressively inserted. An arm is not so stiff that it cannot yield by a slight compressive warping as the contacts encounter leads. Indexing may be ‘by feel’ or by visible indicia along a top surface of the probe or by a reticle device that moves over the top of the IC, which then has a pattern of indicia corresponding to lead location.

Abstract: A probe apparatus has first and second access ports and a measurement port. The first and second access ports are adapted to be interposed in a test circuit. A voltage amplifier and a voltage splitter are adapted to present the second access port and the measurement port each with a voltage representative of a voltage received by the first access port.

Abstract: Probe accessories, and methods for routing signals between a target and a test instrument using the probe accessories, are disclosed. Some of the probe accessories include a flexible circuit and first and second pairs of contacts. Flexible circuit design varies, but one embodiment has first and second regions, a first conductor and a second conductor, and a separation feature. The first conductor extends into the first region while the second conductor extends into both the first and second regions and has a fixed spacing with respect to the first conductor. A separation feature extends between first and second regions and is operable to create two independently maneuverable legs, each leg comprising an end portion of the first and second regions, while maintaining a fixed spacing between the first and second conductors. The first and second pairs of contacts electrically couple the probe accessories between test points and test instruments.

Abstract: A probe retention kit may include a plurality of probe retention devices, each having: (i) a base; (ii) a retention mechanism, coupled to the base, for mechanically coupling a probe substrate with the plurality of probe retention devices; and (iii) solder legs to be inserted into a printed circuit board, the solder legs having opposite ends that extend through the base and provide an alignment mechanism for receiving the probe substrate. Alternative probe retention devices, and systems and methods using same, are also disclosed.

Abstract: A probe includes an electrical element. The probe has reduced parasitic loading. A probe assembly with a plurality of probes is also disclosed.

Abstract: An isolation resistor is incorporated into the plunger of a probe tip spring pin by, for example, doping a ceramic that is used to form the plunger, or forming the plunger of first and second electrically coupled materials, at least a first of which has a resistivity sufficient to serve as an isolation resistor. Alternately, an isolation resistor is embedded in a printed circuit board trace that is used to couple either an upper or lower blind plated hole to a via. A probe tip spring pin is then inserted into the upper blind plated hole.

Abstract: An isolation resistor is incorporated into the plunger of a probe tip spring pin by, for example, doping a ceramic that is used to form the plunger, or forming the plunger of first and second electrically coupled materials, at least a first of which has a resistivity sufficient to serve as an isolation resistor. Alternately, an isolation resistor is embedded in a printed circuit board trace that is used to couple either an upper or lower blind plated hole to a via. A probe tip spring pin is then inserted into the upper blind plated hole.

Abstract: An apparatus, method, and kit for probing a pattern of points on a first printed circuit board are disclosed. In one exemplary embodiment, the apparatus includes a probe having i) a plurality of compression interconnects to probe the pattern of points on the first printed circuit board, and ii) a plurality of fixed pins that are electrically coupled to the compression interconnects. The fixed pins extend from the probe opposite the compression interconnects. The apparatus further includes a flexible wire interconnect having first and second sets of electrically coupled connectors, the first set of which is coupled to the fixed pins of the probe. A second printed circuit board has at least one first connector that is electrically coupled to at least one second connector. The at least one first connector is coupled to the second set of connectors of the flexible wire interconnect, and the at least one second connector is configured to couple to a test instrument.

Abstract: A probe includes an electrical element. The probe has reduced parasitic loading. A probe assembly with a plurality of probes is also disclosed.

Abstract: Uncontrolled characteristic impedance along a spring biased pin probe assembly is avoided by providing a stepped shelf of ground plane that extends outward along the pin and toward the target signal. The length of outward extension is chosen such that even when there is only (or at least) an expected minimum amount of compression of the spring while producing and maintaining contact, the entire exposed portion of the pin is over the shelf, whose depth of step has been selected to produce a selected Z0 for the exposed pin that matches Z0 for existing transmission lines already within the probe assembly. The spring biased pin may be a resistor tip spring pin that includes a small resistor in its tip.

Abstract: In-situ probing of closely spaced signals of SMT components uses a ribbon of flexible printed circuit material. Upon a first distal end of the ribbon are permanently soldered pins to be soldered to component leads carrying the desired signals. The ribbon may be bent to lie against a surface parallel to the plane of the PCB, where a small amount of adhesive or tape may secure it. That parallel surface may be an empty region of the PCB, may be the top of a component having peripheral leads that are being probed or the top of a nearby component, or (for signals emerging from beneath a BGA without peripheral leads) the parallel surface may be the top of the BGA part itself while the probe tips are soldered to the pins of a nearby SMT device, such as an R-Pack. A stiffener may be permanently carried by the ribbon proximate a location where it contacts the parallel surface. A second distal end couples the signal traces to small coaxial cables leading to the test equipment in use.

Abstract: A probe for probing test points on a target board uses a printed circuit board (PCB) having a plurality of signal routes for routing signals to a test instrument. The probe also has a plurality of spring pins for probing the test points on the target board. Each of the spring pins is i) disposed perpendicularly to the PCB, and ii) electrically coupled to at least one signal route of the PCB. By way of example, the spring pins may be fit into holes in the PCB or, alternately, they may be electrically coupled to signal routes of a second PCB that is perpendicularly abutted to the first PCB. Methods for making and using such probes are also disclosed.

Abstract: An interposer probe includes a main board having a first side and a second side. A lower riser board mounted to the first side of the main board and in electrical contact therewith is configured to engage an integrated circuit socket on a device to be tested. An upper riser board mounted to the second side of said main board and in electrical contact therewith, is configured to receive an integrated circuit package. A retention frame mounted to the first side of said main board engages the integrated circuit socket on the device to be tested.

Abstract: A probe retention kit may include a plurality of probe retention devices, each having: (i) a base; (ii) a retention mechanism, coupled to the base, for mechanically coupling a probe substrate with the plurality of probe retention devices; and (iii) solder legs to be inserted into a printed circuit board, the solder legs having opposite ends that extend through the base and provide an alignment mechanism for receiving the probe substrate. Alternative probe retention devices, and systems and methods using same, are also disclosed.