Abstract: A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

Abstract: A method for adjusting the load of a head suspension for supporting a read/write head over a disk in a magnetic disk drive. The suspension includes a load beam having a rigid region and proximal and distal ends, with a base on the proximal end and a flexure on the distal end. A spring region is located between the base and rigid region of the load beam. The spring region includes a pair of arms which extend between the base and rigid region to form a cutout, and a plurality of load adjustment frets which extend across the cutout between the base and rigid region. One or more of the frets can be severed by a laser beam to lower the gram load of the suspension. The gram load of the suspension can be increased by shrinking the frets through exposure to the laser beam. Gram load adjustments can be made with the suspensions in a disk stack assembly by directing the laser beam to the frets through an optical fiber.

Abstract: A head suspension for supporting a read/write head over a disk in a magnetic disk drive. The suspension includes a load beam having a rigid region and proximal and distal ends, with a base on the proximal end and a flexure on the distal end. A spring region is located between the base and rigid region of the load beam. The spring region includes a pair of arms which extend between the base and rigid region to form a cutout, and a plurality of load adjustment frets which extend across the cutout between the base and rigid region. One or more of the frets can be severed by a laser beam to lower the gram load of the suspension. The gram load of the suspension can be increased by shrinking the frets through exposure to the laser beam. Gram load adjustments can be made with the suspensions in a disk stack assembly by directing the laser beam to the frets through an optical fiber.

Abstract: A gimbal and corresponding head suspension assembly including a planar flexure platform having integral static attitude compensation, nominal angle adjustment, and load point etched or etched-formed raised features. The head suspension assembly can also include a load point cover with etched or etched-formed load point features. The etched features are manufactured by masking a pivot point at about the intersection of the roll axis and the pitch axis, thus leaving a raised protuberance having either a pivot point or a load point feature. The process of manufacturing etched-formed features includes etching protuberances and slots. A punch press is then applied to the protuberances. The slots help control the formation of raised domes and provide additional static compensation and nominal angle adjustment pivoting clearance.

Abstract: An integrated lead disk drive suspension including a load beam and one or more conductive leads. The load beam has a mounting region on a proximal end, a head bonding platform on a distal end, and one or more spring regions connecting the head bonding platform to the mounting region. The conductive leads are integrated with and insulated from the load beam by an adhesive dielectric layer, and extend between the head bonding platform and the mounting region. The leads are adapted to reduce mechanical effects of the leads and/or dielectric layer on spring characteristics of the spring regions. One embodiment of the leads includes at least a first compensating portion which extends off the load beam and traverses a nonlinear path around at least a portion of one or more of the spring regions. In another embodiment the portions of the conductive leads extending between the distal end of the load beam and the head bonding platform are substantially free from the dielectric layer.

Abstract: Laminate structures for attachment to a head suspension assembly in a hard disk drive. The laminate structures include a spring metal layer, a conductive layer, and an intermediate insulator/adhesive layer. The conductive layer can act as an interconnect assembly, as a gimbal, and as a spring region. The method of manufacture of the laminate structures incorporates manufacture of an interconnect assembly into the manufacture of spring structures such as a load beam or a gimbal. The laminate structures are manufactured by etching the layers from the outside in, using other layers as etching masks. Unique configurations are possible where either or both metal layers can be discontinuous, thanks to the manufacturing support of the second layer. The second layer can also be shaped into a plurality of panels, thus freeing the metal layers to act as the spring elements.

Abstract: Laminate structures for attachment to a head suspension assembly in a hard disk drive. The laminate structures include a spring metal layer, a conductive layer, and an intermediate insulator/adhesive layer. The conductive layer can act as an interconnect assembly, as a gimbal, and as a spring region. The method of manufacture of the laminate structures incorporates manufacture of an interconnect assembly into the manufacture of spring structures such as a load beam or a gimbal. The laminate structures are manufactured by etching the layers from the outside in, using other layers as etching masks. Unique configurations are possible where either or both metal layers can be discontinuous, thanks to the manufacturing support of the second layer. The second layer can also be shaped into a plurality of panels, thus freeing the metal layers to act as the spring elements.

Abstract: A trace interconnect assembly for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

Abstract: A method for manufacturing a head suspension including separately manufacturing a load beam and a set of traces. The traces are formed from a sheet of conductive material and include an elongated conductor portion and a gimbal portion. Portions of the traces which are configured to be mounted to the load beam are coated with dielectric before being mounted to the load beam. The gimbal portion of the traces provides both mechanical and electrical connections to the conductor portion.

Abstract: A gimbal and corresponding head suspension assembly including a planar flexure platform having integral static attitude compensation, nominal angle adjustment, and load point etched or etched-formed raised features. The head suspension assembly can also include a load point cover with etched or etched-formed load point features. The etched features are manufactured by masking a pivot point at about the intersection of the roll axis and the pitch axis, thus leaving a raised protuberance having either a pivot point or a load point feature. The process of manufacturing etched-formed features includes etching protuberances and slots. A punch press is then applied to the protuberances. The slots help control the formation of raised domes and provide additional static compensation and nominal angle adjustment pivoting clearance.

Abstract: A gimbal flexure and electrical interconnect assembly for attachment to a disk drive suspension assembly. The gimbal flexure and electrical interconnect acts both as an interconnect system for relaying electrical signals and as a gimbal flexure. It comprises a self-supporting set of generally parallel traces--electrically insulated linear substrate-free conductors constructed of a single layer spring material. The set of traces includes a load beam portion extending over and matching the surface topology of at least a section of the first surface of a load beam, and a gimbal portion located at a distal end of the set of traces shaped as a gimbal flexure means. The invention describes specific embodiments, including head harnesses, suspension assemblies, and head suspension assemblies, as well as manufacturing methods.

Abstract: A head suspension assembly for positioning a head assembly at the correct static attitude with respect to the surface of a rotatable data storage device. The head assembly includes a gimbal assembly having a novel static attitude adjustment feature comprising a solid drop of material. The solid drop of material is dispensed as a fluid on the desired location and then cured to solid form. The solidified drop of material can be used to create surface features on head suspension assemblies for correcting pitch and roll static attitude errors and for applying gram loads on the head assembly.