Patents by Inventor Brent F. Teasley

Brent F. Teasley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030170920
    Abstract: A method for estimating the likely waviness of a wafer after polishing based upon an accurate measurement of the waviness of the wafer in an as-cut condition, before polishing. The method measures the thickness profile of an upper and lower wafer surface to construct a median profile of the wafer in the direction of wiresaw cutting. The median surface is then passed through an appropriate Gaussian filter, such that the warp of the resulting profile estimates whether the wafer will exhibit unacceptable waviness in a post-polished stage.
    Type: Application
    Filed: March 7, 2002
    Publication date: September 11, 2003
    Applicant: MEMC Electronic Materials, Inc.
    Inventors: Milind S. Bhagavat, Yun-Biao Xin, Gary L. Anderson, Brent F. Teasley
  • Patent number: 6613591
    Abstract: A method for estimating the likely waviness of a wafer after polishing based upon an accurate measurement of the waviness of the wafer in an as-cut condition, before polishing. The method measures the thickness profile of an upper and lower wafer surface to construct a median profile of the wafer in the direction of wiresaw cutting. The median surface is then passed through an appropriate Gaussian filter, such that the warp of the resulting profile estimates whether the wafer will exhibit unacceptable waviness in a post-polished stage.
    Type: Grant
    Filed: March 7, 2002
    Date of Patent: September 2, 2003
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Milind S. Bhagavat, Yun-Biao Xin, Gary L. Anderson, Brent F. Teasley