Abstract: A lithographic scanner collects surface height information concurrently with conducting a lithographic scan process. A defect identification module identifies wafers having a surface height metric greater than a determined threshold. The identified wafers may be separated for rework to correct the surface defects such as hotspots and improve manufacturing yield without requiring additional equipment. In one embodiment, the surface height metric is a maximum variation from a moving average surface height. In one embodiment, yield data is correlated with surface height information to determine a threshold value corresponding to defective circuit die.

Abstract: A method for compensating a focus of an exposure field of view in an exposure tool. A height at a plurality of positions is measured across a substrate at a given layer using a tool other than the exposure tool. Edge positions on the substrate are identified where the height varies significantly from the height in center portions of the substrate. A focus compensation value is developed for the identified edge positions, and the identified edge positions are correlated with exposure fields of view on the exposure tool. The focus compensation value is input in an exposure program for use when the exposure tool focuses on the exposure fields of view that correlate with the identified edge positions. The method is repeated for as many layers of the substrate as desired.