Abstract: An isolation resistor is incorporated into the plunger of a probe tip spring pin by, for example, doping a ceramic that is used to form the plunger, or forming the plunger of first and second electrically coupled materials, at least a first of which has a resistivity sufficient to serve as an isolation resistor. Alternately, an isolation resistor is embedded in a printed circuit board trace that is used to couple either an upper or lower blind plated hole to a via. A probe tip spring pin is then inserted into the upper blind plated hole.

Abstract: An interposer probe includes a main board having a first side and a second side. A lower riser board mounted to the first side of the main board and in electrical contact therewith is configured to engage an integrated circuit socket on a device to be tested. An upper riser board mounted to the second side of said main board and in electrical contact therewith, is configured to receive an integrated circuit package. A retention frame mounted to the first side of said main board engages the integrated circuit socket on the device to be tested.

Abstract: A probe retention kit may include a plurality of probe retention devices, each having: (i) a base; (ii) a retention mechanism, coupled to the base, for mechanically coupling a probe substrate with the plurality of probe retention devices; and (iii) solder legs to be inserted into a printed circuit board, the solder legs having opposite ends that extend through the base and provide an alignment mechanism for receiving the probe substrate. Alternative probe retention devices, and systems and methods using same, are also disclosed.

Abstract: In a method for probing a grid array package, a probe having a plurality of probe tip spring pins therein is aligned with a plurality of breakout vias on a printed circuit board. The breakout vias are on a side of the printed circuit board opposite a side of the printed circuit board to which the grid array package is attached. The probe tip spring pins are engaged with the breakout vias, and the probe is then mechanically coupled to the printed circuit board to keep the probe tip spring pins engaged with the breakout vias. Various embodiments and methods of constructing the probe are also disclosed.

Abstract: A probe for probing test points on a target board uses a printed circuit board (PCB) having a plurality of signal routes for routing signals to a test instrument. The probe also has a plurality of spring pins for probing the test points on the target board. Each of the spring pins is i) disposed perpendicularly to the PCB, and ii) electrically coupled to at least one signal route of the PCB. By way of example, the spring pins may be fit into holes in the PCB or, alternately, they may be electrically coupled to signal routes of a second PCB that is perpendicularly abutted to the first PCB. Methods for making and using such probes are also disclosed.

Abstract: A connector-less probe is disclosed. The probe permits probing of a board or bus without the use of a mating connector. The probe has a support attached to the probing end of the probe. A spring pin and an isolation network are attached to the support. The support is arranged substantially perpendicular to a target board during probing of a test point on the target board. The spring pin engages the test point on the target board. The spring pin is arranged substantially perpendicular to the target board when the spring pin engages the test point on the target board, and the spring pin is securely attached to the support so that the spring pin is substantially parallel to the support. The isolation network is electrically coupled to the spring pin so that the spring pin is located between the isolation network and the test point during probing of the test point. The isolation network is also securely attached to the support.

Abstract: An alignment/retention device. The device includes a housing having a first side and an opposing second side. The housing includes an opening which extends from the first side to the second side. Multiple alignment pins are imbedded in the housing and extend external to both the first and second sides. On the first side the alignment pins are capable of insertion into matching holes on an electronic probe, and on the second side the alignment pins are capable of insertion into matching holes on an electronic circuit assembly.

Abstract: A connector-less probe is disclosed. The probe permits probing of a board or bus without the use of a mating connector. The probe has a support attached to the probing end of the probe. A spring pin and an isolation network are attached to the support. The support is arranged substantially perpendicular to a target board during probing of a test point on the target board. The spring pin engages the test point on the target board. The spring pin is arranged substantially perpendicular to the target board when the spring pin engages the test point on the target board, and the spring pin is securely attached to the support so that the spring pin is substantially parallel to the support. The isolation network is electrically coupled to the spring pin so that the spring pin is located between the isolation network and the test point during probing of the test point. The isolation network is also securely attached to the support.

Abstract: A probe assembly provides the capability to test integrated circuit (“IC”) packages mounted onto ball grid arrays. The method comprises the step of first creating the lay out of the flexible attachment. Top and bottom rigid PC Boards are lain out and drilled. The drill creates holes that are the press fit diameter of nail pin. The holes are then plated with an annular ring on the outer exposed surface. The next step comprises laminating the flexible circuit between the two rigid PC Boards. Press fit nail pins are inserted through the holds in one side of the laminate sandwich until flush with the surface of the PC Board. Solder preforms are soldered the bottom surface of the laminate sandwich. The preforms mechanically and electrically attach the pins to the bottom rigid PC Board. A BGA socket can then be attached to the pins extending from the bottom of the laminated Flex-Rigid-Flex assembly.

Abstract: An integrated probe assembly provides the capability to test integrated circuit (IC) packages mounted onto ball grid arrays. The present invention comprises an unsealed BGA socket (102), nail head pins (107) which can be inserted flush into a pin carrier to produce a PGA header (103), a Flex circuit assembly comprising a piece of flexible circuit (104) with various passive resistors and connectors attached and solder preforms (113) used to solder the flex assembly to the pin grid array. Matched impedance connectors (105) are attached at an end of the flexible circuit.

Abstract: The method of the invention comprises the steps of soldering a BGA socket onto a PGA header, inserting a flex assembly onto the BGA-PGA assembly, placing solder preforms over the PGA pins and then reflowing the flex assembly to the BGA-PGA assembly.

Abstract: An electrical connector for electrically interconnecting printed circuit boards. In representative embodiments, an electrical connector is disclosed which comprises a flexible, resilient conductor shaped so as to form first and second end sections located at opposite ends of a central section. The first end section comprises a first segment adjacent to and bent at a first angle from the central section, a second segment adjacent to and bent at a second angle from the first segment, a third segment adjacent to and bent at a third angle from the second segment, and a fourth segment adjacent to and bent at a fourth angle from the third segment. The second end section comprises a fifth segment adjacent to and bent at a fifth angle from the central section, a sixth segment adjacent to and bent at a sixth angle from the fifth segment, a seventh segment adjacent to and bent at a seventh angle from the sixth segment, and an eighth segment adjacent to and bent at an eighth angle from the seventh segment.

Abstract: A probe assembly provides the capability to test integrated circuit (“IC”) packages mounted onto ball grid arrays. The method comprises the step of first creating the lay out of the flexible attachment. Top and bottom rigid PC Boards are lain out and drilled. The drill creates holes that are the press fit diameter of nail pin. The holes are then plated with an annular ring on the outer exposed surface. The next step comprises laminating the flexible circuit between the two rigid PC Boards. Press fit nail pins are inserted through the holds in one side of the laminate sandwich until flush with the surface of the PC Board. Solder preforms are soldered the bottom surface of the laminate sandwich. The preforms mechanically and electrically attach the pins to the bottom rigid PC Board. A BGA socket can then be attached to the pins extending from the bottom of the laminated Flex-Rigid-Flex assembly.

Abstract: In a preferred embodiment, the present invention comprises an unsealed BGA socket, nail head pins which can be inserted flush into an pin carrier to produce a PGA header, a Flex circuit assembly comprising a piece of flexible circuit with various passive resistors and connectors attached and solder preforms used to solder the flex assembly to the pin grid array.

Abstract: The method of the invention comprises the steps of soldering a BGA socket onto a PGA header, inserting a flex assembly onto the BGA-PGA assembly, placing solder preforms over the PGA pins and then reflowing the flex assembly to the BGA-PGA assembly.

Abstract: A probe assembly provides the capability to test integrated circuit (“IC”) packages mounted onto ball grid arrays. The method comprises the step of first creating the lay out of the flexible attachment. Top and bottom rigid PC Boards are lain out and drilled. The drill creates holes that are the press fit diameter of nail pin. The holes are then plated with an annular ring on the outer exposed surface. The next step comprises laminating the flexible circuit between the two rigid PC Boards. Press fit nail pins are inserted through the holds in one side of the laminate sandwich until flush with the surface of the PC Board. Solder preforms are soldered the bottom surface of the laminate sandwich. The preforms mechanically and electrically attach the pins to the bottom rigid PC Board. A BGA socket can then be attached to the pins extending from the bottom of the laminated Flex-Rigid-Flex assembly.

Abstract: A module retention adapter for attaching enabled heat sinks to the user target system while validating a processor with an LAI tool. In a preferred embodiment, the invention comprises an adapter and a clip. A user attaches an adapter to each retention module on a target system. Once a processor is loaded into the LAI tool and a heat sink solution is loaded onto the processor between the adapters. The heat sink clips are then clipped onto the adapters. The clips retain the heat sink to the adapters while also retaining the heat sink to the motherboard retention modules.

Abstract: Edge mounting flexible media to a rigid PC board construction can be achieved by various methods. In any method used, there is a desire to create solderable pads on the edge of the rigid PC board. In accordance with the invention, the solderable pads are created by edge plating the PC Board or by a sliced via method. Depending on the type of flexible transmission line used, the construction will differ accordingly. For terminating flexible circuit media, the flex pads are laid out in such a way that the pads are etched in a configuration that matches up with the edge pads on the rigid PC Board. Solder past is then applied to the pads on the flex. The rigid PC Board is fixtured at a right angle to the flex and run through the reflow oven.