Abstract: A printed circuit is produced with a base circuit and a number of optional circuit elements. One or more of the optional circuit elements may be added to the base circuit to determine or change the characteristics of the base circuit. Alternatively, one or more of the optional circuit elements may be removed from the base circuit to determine or change the characteristics of the base circuit. The base circuit and optional circuit elements may be printed on a single substrate. Mechanisms may be provided to facilitate the separation of the optional elements form the substrate either to introduce them into the base circuit or remove them from the base circuit to change the characteristics of the base circuit. A simple, low-cost, robust, and easy to use base circuit and optional circuit element is provided.

Abstract: A printed circuit is produced with a base circuit and a number of optional circuit elements. One or more of the optional circuit elements may be added to the base circuit to determine or change the characteristics of the base circuit. Alternatively, one or more of the optional circuit elements may be removed from the base circuit to determine or change the characteristics of the base circuit. The base circuit and optional circuit elements may be printed on a single substrate. Mechanisms may be provided to facilitate the separation of the optional elements form the substrate either to introduce them into the base circuit or remove them from the base circuit to change the characteristics of the base circuit. A simple, low-cost, robust, and easy to use base circuit and optional circuit element is provided.

Abstract: A method for sealing microstructured cells, which are defined by at least a first substrate and a wall microstructure extending from the first substrate, includes a step of applying a plurality of adhesive microcapsules along at least one of a first side of a second substrate and an exposed end portion of the wall microstructure. The adhesive microcapsules containing an adhesive substance. Another step includes positioning the first side of the second substrate adjacent the end portion of the wall microstructure. Still another step includes rupturing at least a portion of the plurality of adhesive microcapsules dispensing the adhesive substance between the end portion of the wall microstructure and the first side of the second substrate. A microstructure is also provided.

Abstract: A spring structure in which the transition of a metal layer from a solid solution to an intermetallic compound is utilized either to bend a spring finger into a curved shape, or to increase the yield point of the spring finger. The spring finger has an anchor portion attached to a substrate, and a cantilever portion extending over the substrate surface. The metal layer forms at least a portion of the spring finger. The metal layer is initially formed as a solid solution including a primary and secondary elements that transform to an intermetallic compound upon annealing, thereby generating a bending force that causes the cantilever portion of the spring finger to bend relative to the substrate, and/or to increase the yield point of the bent cantilever portion. The metal layer is formed by plating and/or sputtering, and annealing is performed before and/or after release of the cantilever portion.

Abstract: Various structures or components can include plated surfaces or other parts. For example, an article can include a base and a plated part with a limit artifact that results from plating adjacent a non-plateable surface; the limit artifact can be disposed away from the base. Exemplary limit artifacts include lack of protrusions, smooth upper surfaces, and curved surfaces, where a curved surface can transition between a smooth upper surface and an irregular side surface. Exemplary plated structures can be tube-shaped or cup-shaped, with an opening at a top end and, around the opening, a lip with a limit artifact. Wall-like structures can similarly have limit artifacts at their top end. If plating on a mold's side surface, the non-plateable surface can be the lower surface of an overhanging polymer disk or structure positioned on the mold. Plated tubes and wall-like structures can be employed in microfluidic structures.

Abstract: An electrophoretic-type display device including an array of microcells, where each microcell is formed by a microwell containing a quantity of ink and a polymer-based membrane connected to upper edges of the microwell. The membrane is formed by curing an aqueous or hydroalcoholic sealing solution that is overcoated on the ink-filled microwells. The ink includes an isoparaffinic-based or oil-based suspension fluid, and the peripheral side walls of the microwell have a surface energy in the range of 20 to 30 mN/m. The microwell material serves two purposes: to prevent displacement (floating) of the relatively light ink solution above the relatively heavy sealing solution, and to facilitate reliable attachment between the polymer membrane and microwell walls during subsequent curing.

Abstract: A novel reflective display system is described. The display system is viewable through the display backplane instead of the counterelectrode. Making the display viewable through the backplane allows use of a conducting elastomer as a counterelectrode which facilitates fabrication of a flexible display. The rear-viewable display also facilitates attachment of color filters directly to the backplane simplifying filter pixel alignment issues.

Abstract: A spring structure in which the transition of a metal layer from a solid solution to an intermetallic compound is utilized either to bend a spring finger into a curved shape, or to increase the yield point of the spring finger. The spring finger has an anchor portion attached to a substrate, and a cantilever portion extending over the substrate surface. The metal layer forms at least a portion of the spring finger. The metal layer is initially formed as a solid solution including a primary and secondary elements that transform to an intermetallic compound upon annealing, thereby generating a bending force that causes the cantilever portion of the spring finger to bend relative to the substrate, and/or to increase the yield point of the bent cantilever portion. The metal layer is formed by plating and/or sputtering, and annealing is performed before and/or after release of the cantilever portion.

Abstract: Spring structures are subjected to pre-release and post-release annealing to tune their tip height to match a specified target. Post-release annealing increases tip height, and pre-release annealing decreases tip height. The amount of tuning is related to the annealing temperature and/or time. Annealing schedules are determined for a pre-fabricated cache of unreleased spring structures such that finished spring structures having a variety of target heights can be economically produced by releasing/annealing the cache according to associated annealing schedules. Selective annealing is performed using lasers and heat absorbing/reflecting materials. Localized annealing is used to generate various spring structure shapes. Both stress-engineered and strain-engineered spring structures are tuned by annealing.