Abstract: A ruggedized miniaturized infrared camera system for harsh environments has an infrared camera module that is connected to a ruggedized camera mount. The camera mount has a body and a lens clamp that clamps the camera lens to the body. The camera mount and military-spec fasteners cooperate to mechanically secure the camera module from vibrations. An interface bracket is attached to the camera mount and has a central opening. A signal connector is attached to the exterior side of the bracket and configured to carry USB2 signals. Conductive pins of the signal connector extend through the central opening and are electrically coupled to a circuit board that is adjacent to the interior side of the bracket. An electrically non-conductive spacer is within the central opening and interposed between the signal connector and circuit board. Heat-conductive epoxy secures the circuit board from vibrations and creates thermal bonds that passively remove heat.