Abstract: A microelectronic device comprises a first substrate (110) having a first electrically conductive path (111) therein and a second substrate (120) above the first substrate and having a second electrically conductive path (121) therein, wherein the first electrically conductive path and the second electrically conductive path are electrically connected to each other and form a portion of a current loop (131) of an inductor (130).

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.

Abstract: A microelectronic package includes first substrate (120) having first surface area (125) and second substrate (130) having second surface area (135). The first substrate includes first set of interconnects (126) having first pitch (127) at first surface (121) and second set of interconnects (128) having second pitch (129) at second surface (222). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects (236) having third pitch (237) and internal electrically conductive layers (233, 234) connected to each other with microvia (240). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.

Abstract: A microelectronic package includes first substrate (120) having first surface area (125) and second substrate (130) having second surface area (135). The first substrate includes first set of interconnects (126) having first pitch (127) at first surface (121) and second set of interconnects (128) having second pitch (129) at second surface (222). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects (236) having third pitch (237) and internal electrically conductive layers (233, 234) connected to each other with microvia (240). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.

Abstract: A microelectronic package includes first substrate (120) having first surface area (125) and second substrate (130) having second surface area (135). The first substrate includes first set of interconnects (126) having first pitch (127) at first surface (121) and second set of interconnects (128) having second pitch (129) at second surface (222). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects (236) having third pitch (237) and internal electrically conductive layers (233, 234) connected to each other with microvia (240). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.

Abstract: A microelectronic package includes first substrate (120) having first surface area (125) and second substrate (130) having second surface area (135). The first substrate includes first set of interconnects (126) having first pitch (127) at first surface (121) and second set of interconnects (128) having second pitch (129) at second surface (222). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects (236) having third pitch (237) and internal electrically conductive layers (233,234) connected to each other with microvia (240). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.

Abstract: A microelectronic device comprises a first substrate (110) having a first electrically conductive path (111) therein and a second substrate (120) above the first substrate and having a second electrically conductive path (121) therein, wherein the first electrically conductive path and the second electrically conductive path are electrically connected to each other and form a portion of a current loop (131) of an inductor (130).

Abstract: In some embodiments, direct power delivery into an electronic package is presented. In this regard, a substrate is introduced having a conductive substrate core designed to physically connect with a power cable. Other embodiments are also disclosed and claimed.