Patents by Inventor Brent Stapleton

Brent Stapleton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High power cavity package for light emitters
    Patent number: 10971892
    Abstract: An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 6, 2021
    Assignee: II-VI DELAWARE, INC.
    Inventors: Brent Stapleton, Pritha Khurana, Nathan Lye
  • HIGH POWER CAVITY PACKAGE FOR LIGHT EMITTERS
    Publication number: 20200028320
    Abstract: An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.
    Type: Application
    Filed: August 6, 2019
    Publication date: January 23, 2020
    Inventors: Brent Stapleton, Pritha Khurana, Nathan Lye
  • High power cavity package for light emitters
    Patent number: 10374387
    Abstract: An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: August 6, 2019
    Assignee: FINISAR CORPORATION
    Inventors: Brent Stapleton, Pritha Khurana, Nathan Lye
  • HIGH POWER CAVITY PACKAGE FOR LIGHT EMITTERS
    Publication number: 20190146319
    Abstract: An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.
    Type: Application
    Filed: November 10, 2017
    Publication date: May 16, 2019
    Inventors: Brent Stapleton, Pritha Khurana, Nathan Lye
  • Chip on flex optical subassembly
    Patent number: 9709760
    Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: July 18, 2017
    Assignee: FINISAR CORPORATION
    Inventors: Brent Stapleton, Rajeev Dwivedi, Harold Young Walker, Jr., Gary Landry
  • CHIP ON FLEX OPTICAL SUBASSEMBLY
    Publication number: 20160341920
    Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.
    Type: Application
    Filed: May 9, 2016
    Publication date: November 24, 2016
    Inventors: Brent Stapleton, Rajeev Dwivedi, Harold Young Walker, JR., Gary Landry
  • Chip on flex optical subassembly
    Patent number: 9337932
    Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: May 10, 2016
    Assignee: FINISAR CORPORATION
    Inventors: Brent Stapleton, Rajeev Dwivedi, Harold Young Walker, Jr., Gary Landry