Abstract: A liquid cooled power dissipation apparatus (10) includes a metal matrix composite heat sink (11) with an insulation layer (17) integral to the apparatus (10). The insulation layer (17) is made integral to the apparatus (10) during infiltration of the metal matrix composite heat sink (11). Electronic components 23 are situated on top of the insulation layer (17).

Abstract: A single, integral Metal Matrix Composite structure (47) includes a base plate (11), circuit layer (25), and lead supports (30,32), forming the single integral structure (47). Such a structure is particularly suited for power module applications. The various elements are well matched, thermally. Additionally, the structure (47) can be fabricated using straightforward molding processes, rather than complicated, fixtured, bonding and solder processes which are typically used for conventional power modules.

Abstract: A power transistor (11) having a control electrode (16), a first electrode (17), a second electrode (181), and a kelvin electrode (19) is provided. The power transistor (11) comprises a plurality of transistors (12-15) coupled in parallel. Each transistor having a control electrode, a first electrode, and a second electrode coupled respectively to the control electrode (16) , first electrode (17) , and second electrode (18) of the power transistor (11). A plurality of first resistors (26-29) reduce oscillation and ringing, each first resistor is coupled between the kelvin electrode (19) and a second electrode of a transistor of the plurality of transistors (12-15). A plurality of second resistors (21-24) also reduces oscillation and ringing, each second resistor is coupled between the control electrode (16) and a control electrode of a transistor of the plurality of transistors (12-15).